Datasheets
M470L3324BT0-CB3 by: Samsung Semiconductor

DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200

Part Details for M470L3324BT0-CB3 by Samsung Semiconductor

Overview of M470L3324BT0-CB3 by Samsung Semiconductor

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Applications Education and Research Consumer Electronics Computing and Data Storage

Part Details for M470L3324BT0-CB3

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M470L3324BT0-CB3 Part Data Attributes

M470L3324BT0-CB3 Samsung Semiconductor
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M470L3324BT0-CB3 Samsung Semiconductor DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code SODIMM
Package Description DIMM, DIMM200,24
Pin Count 200
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code R-XZMA-N200
JESD-609 Code e0
Memory Density 2147483648 bit
Memory IC Type DDR DRAM MODULE
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 200
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX64
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIMM
Package Equivalence Code DIMM200,24
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified
Refresh Cycles 8192
Self Refresh YES
Supply Current-Max 1.62 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD
Terminal Pitch 0.6 mm
Terminal Position ZIG-ZAG

Alternate Parts for M470L3324BT0-CB3

This table gives cross-reference parts and alternative options found for M470L3324BT0-CB3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M470L3324BT0-CB3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYMD232M646A8-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD232M646A8-J
HYMD232M646DL8-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD232M646DL8-J
HYMD232M646AL8-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD232M646AL8-J
M470L3223DT0-CB3 DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3223DT0-CB3
M470L3324DU0-CB3 DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3324DU0-CB3
HYMD532M646CL6-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, PDMA200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD532M646CL6-J
HYMD532M646C6-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, PDMA200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD532M646C6-J
HYMD532M646AL6-J DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 SK Hynix Inc M470L3324BT0-CB3 vs HYMD532M646AL6-J
M470L3324CU0-CB3 DDR DRAM Module, 32MX64, 0.7ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3324CU0-CB3
NT256D64SH4B0FM-6K DDR DRAM Module, 32MX64, 0.7ns, CMOS, SODIMM-200 Nanya Technology Corporation M470L3324BT0-CB3 vs NT256D64SH4B0FM-6K
Part Number Description Manufacturer Compare
V826632B24SATL-D3 DDR DRAM, 32MX64, 0.65ns, CMOS, DIMM-200 ProMOS Technologies Inc M470L3324BT0-CB3 vs V826632B24SATL-D3
HYMD232646AL8-H DDR DRAM Module, 32MX64, 0.75ns, CMOS, 5.250 X 1.250 X 0.150 INCH, DIMM-184 SK Hynix Inc M470L3324BT0-CB3 vs HYMD232646AL8-H
M470L3224DT0-LB0 DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3224DT0-LB0
NT256D64SH8C0GM-75B DDR DRAM Module, 32MX64, 0.75ns, CMOS, SODIMM-200 Nanya Technology Corporation M470L3324BT0-CB3 vs NT256D64SH8C0GM-75B
V826632K24SXTG-D0 DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Mosel Vitelic Corporation M470L3324BT0-CB3 vs V826632K24SXTG-D0
V826632K24SAIX-D3 DDR DRAM Module, 32MX64, 0.65ns, CMOS, GREEN, DIMM-184 ProMOS Technologies Inc M470L3324BT0-CB3 vs V826632K24SAIX-D3
M470L3324DU0-LCC DDR DRAM Module, 32MX64, 0.65ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3324DU0-LCC
M368L3223FTN-LC4 DDR DRAM Module, 32MX64, 0.65ns, CMOS, DIMM-184 Samsung Semiconductor M470L3324BT0-CB3 vs M368L3223FTN-LC4
W3HG32M64EEU403D4SG DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 Microsemi Corporation M470L3324BT0-CB3 vs W3HG32M64EEU403D4SG
M470L3324BU0-LB0 DDR DRAM Module, 32MX64, 0.75ns, CMOS, ROHS COMPLIANT, SODIMM-200 Samsung Semiconductor M470L3324BT0-CB3 vs M470L3324BU0-LB0

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