Part Details for M38867E8AFS by Renesas Electronics Corporation
Overview of M38867E8AFS by Renesas Electronics Corporation
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Part Details for M38867E8AFS
M38867E8AFS CAD Models
M38867E8AFS Part Data Attributes
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M38867E8AFS
Renesas Electronics Corporation
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M38867E8AFS
Renesas Electronics Corporation
8-BIT, UVPROM, 5MHz, MICROCONTROLLER, CQCC80, 0.80 MM PITCH, CERAMIC, LCC-80
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LCC | |
| Package Description | 0.80 MM PITCH, CERAMIC, LCC-80 | |
| Pin Count | 80 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Additional Feature | ALSO OPERATES AT 2.7V MIN SUPPLY | |
| Address Bus Width | 16 | |
| Bit Size | 8 | |
| CPU Family | MELPS740 | |
| Clock Frequency-Max | 10 MHz | |
| DAC Channels | YES | |
| DMA Channels | NO | |
| External Data Bus Width | 8 | |
| JESD-30 Code | R-CQCC-N80 | |
| Length | 21 mm | |
| Number of I/O Lines | 72 | |
| Number of Terminals | 80 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HQCCN | |
| Package Equivalence Code | LCC80,.55X.8,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 1024 | |
| ROM (words) | 32768 | |
| ROM Programmability | UVPROM | |
| Seated Height-Max | 3.32 mm | |
| Speed | 5 MHz | |
| Supply Current-Max | 15 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 15.6 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |