Part Details for M38510/31902BFA by Rochester Electronics LLC
Overview of M38510/31902BFA by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for M38510/31902BFA
M38510/31902BFA CAD Models
M38510/31902BFA Part Data Attributes:
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M38510/31902BFA
Rochester Electronics LLC
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M38510/31902BFA
Rochester Electronics LLC
Memory Circuit, 4X4, CMOS, CDFP16, CERAMIC, DFP-16
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | DFP | |
| Package Description | DFP, FL16,.3 | |
| Pin Count | 16 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| JESD-30 Code | R-CDFP-F16 | |
| JESD-609 Code | e0 | |
| Memory Density | 16 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 4 words | |
| Number of Words Code | 4 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4X4 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DFP | |
| Package Equivalence Code | FL16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38535 Class B | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL |
Alternate Parts for M38510/31902BFA
This table gives cross-reference parts and alternative options found for M38510/31902BFA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/31902BFA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DS2405+ | Memory Circuit, 64X1, CMOS, PBCY3, ROHS COMPLIANT, TO-92, 3 PIN | Maxim Integrated Products | M38510/31902BFA vs DS2405+ |
| M38510/31901BEA | Memory Circuit, 4X4, CMOS, CDIP16, CERAMIC, DIP-16 | Lansdale Semiconductor Inc | M38510/31902BFA vs M38510/31901BEA |
| M38510/31902B2A | Memory Circuit, 4X4, CMOS, CQCC20, CERAMIC, LCC-20 | Lansdale Semiconductor Inc | M38510/31902BFA vs M38510/31902B2A |
| M38510/31901B2C | Memory Circuit, 4X4, CMOS, CQCC20, CERAMIC, LCC-20 | Lansdale Semiconductor Inc | M38510/31902BFA vs M38510/31901B2C |
| M38510/31901BEA | SPECIALTY MEMORY CIRCUIT, CDIP16, CERAMIC, DIP-16 | Texas Instruments | M38510/31902BFA vs M38510/31901BEA |
| M38510/31901B2A | Memory Circuit, 4X4, CMOS, CQCC20, CERAMIC, LCC-20 | Lansdale Semiconductor Inc | M38510/31902BFA vs M38510/31901B2A |