Memory
M38510/24403BEX
Description: Page Mode DRAM, 64KX1, 200ns, NMOS, 0.25 X 0.875 INCH, DIP-16

Overview of M38510/24403BEX by LSI Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

CAD Models for M38510/24403BEX by LSI Corporation
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Part Data Attributes for M38510/24403BEX by LSI Corporation

M38510/24403BEX
LSI Corporation
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
16
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.02
Access Time-Max
200 ns
Additional Feature
RAS ONLY REFRESH
JESD-30 Code
R-XDIP-T16
Memory Density
65536 bit
Memory IC Type
PAGE MODE DRAM
Memory Width
1
Number of Functions
1
Number of Ports
1
Number of Terminals
16
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
110 °C
Operating Temperature-Min
-55 °C
Organization
64KX1
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
NMOS
Temperature Grade
OTHER
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
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  1. M38510/24403BEX
    LSI Corporation
    Page Mode DRAM, 64KX1, 200ns, NMOS, 0.25 X 0.875 INCH, DIP-16
    VS

Alternate Parts for M38510/24403BEX

This table gives cross-reference parts and alternative options found for M38510/24403BEX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/24403BEX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
M38510/24403BEX 64KX1 PAGE MODE DRAM, 200ns, DIP16, 0.25 X 0.875 INCH, DIP-16 STMicroelectronics M38510/24403BEX vs M38510/24403BEX
M38510/24403BEA 64KX1 PAGE MODE DRAM, 200ns, DIP16, 0.25 X 0.875 INCH, DIP-16 STMicroelectronics M38510/24403BEX vs M38510/24403BEA
Part Number Description Manufacturer Compare
MB8281-15P Static Column DRAM, 64KX1, 150ns, NMOS, PDIP16, PLASTIC, DIP-16 FUJITSU Semiconductor Limited M38510/24403BEX vs MB8281-15P
D2164A-15 Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 Intel Corporation M38510/24403BEX vs D2164A-15
P51C64L-10 Nibble Mode DRAM, 64KX1, 100ns, CMOS, PDIP16, PLASTIC, DIP-16 Intel Corporation M38510/24403BEX vs P51C64L-10
SMJ4164-15JDE 64KX1 PAGE MODE DRAM, 150ns, CDIP16, 0.300 INCH, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-16 Texas Instruments M38510/24403BEX vs SMJ4164-15JDE
MB8264A-15-W Page Mode DRAM, 64KX1, 150ns, NMOS, CDIP16, CERDIP-16 FUJITSU Semiconductor Limited M38510/24403BEX vs MB8264A-15-W
8201008EA Page Mode DRAM, 64KX1, 120ns, NMOS, CDIP16, CERAMIC, DIP-16 Rochester Electronics LLC M38510/24403BEX vs 8201008EA
P51C64L-12 Nibble Mode DRAM, 64KX1, 120ns, CMOS, PDIP16, PLASTIC, DIP-16 Intel Corporation M38510/24403BEX vs P51C64L-12
8201003EX Page Mode DRAM, 64KX1, 200ns, NMOS, CDIP16, CERAMIC, DIP-16 Thales Components Corp M38510/24403BEX vs 8201003EX
MSM3764A-15RS Page Mode DRAM, 64KX1, 150ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 OKI Electric Industry Co Ltd M38510/24403BEX vs MSM3764A-15RS
M38510/24403BEA 64KX1 PAGE MODE DRAM, 200ns, DIP16, 0.25 X 0.875 INCH, DIP-16 STMicroelectronics M38510/24403BEX vs M38510/24403BEA

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