Part Details for M27C4002-20XF6TR by STMicroelectronics
Overview of M27C4002-20XF6TR by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for M27C4002-20XF6TR
M27C4002-20XF6TR CAD Models
M27C4002-20XF6TR Part Data Attributes
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M27C4002-20XF6TR
STMicroelectronics
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Datasheet
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M27C4002-20XF6TR
STMicroelectronics
256KX16 UVPROM, 200ns, CDIP40, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-40
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-CDIP-T40 | |
| Length | 52.195 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX16 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Supply Current-Max | 0.07 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 13.2 mm |
Alternate Parts for M27C4002-20XF6TR
This table gives cross-reference parts and alternative options found for M27C4002-20XF6TR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C4002-20XF6TR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C4096-200DI | UVPROM, 256KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | M27C4002-20XF6TR vs AM27C4096-200DI |
| AM27C4096-200/BQA | UVPROM, 256KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | M27C4002-20XF6TR vs AM27C4096-200/BQA |
| AT27LV4096-20DC | UVPROM, 256KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | Atmel Corporation | M27C4002-20XF6TR vs AT27LV4096-20DC |
| AM27C4096-200/BXA | UVPROM, 256KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | M27C4002-20XF6TR vs AM27C4096-200/BXA |
| M27C4002-20XB6TR | 256KX16 UVPROM, 200ns, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40 | STMicroelectronics | M27C4002-20XF6TR vs M27C4002-20XB6TR |
| AM27C4096-200DCB | UVPROM, 256KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | M27C4002-20XF6TR vs AM27C4096-200DCB |
| M27C4002-20F1 | 256KX16 UVPROM, 200ns, CDIP40, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-40 | STMicroelectronics | M27C4002-20XF6TR vs M27C4002-20F1 |
| AM27C4096-200DC | UVPROM, 256KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | M27C4002-20XF6TR vs AM27C4096-200DC |
| AM27C4096-205DC | UVPROM, 256KX16, 200ns, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 | AMD | M27C4002-20XF6TR vs AM27C4096-205DC |
| AT27C4096-20DC | UVPROM, 256KX16, 200ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | Atmel Corporation | M27C4002-20XF6TR vs AT27C4096-20DC |