Part Details for M27512F6 by STMicroelectronics
Overview of M27512F6 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for M27512F6
M27512F6 CAD Models
M27512F6 Part Data Attributes
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M27512F6
STMicroelectronics
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Datasheet
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M27512F6
STMicroelectronics
64KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 250 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Memory Density | 524288 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.71 mm | |
Supply Current-Max | 0.125 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27512F6
This table gives cross-reference parts and alternative options found for M27512F6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27512F6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TMX27C512-25JL | 64KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, CERDIP-28 | Texas Instruments | M27512F6 vs TMX27C512-25JL |
TMS27C512-25JE4 | 64KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27512F6 vs TMS27C512-25JE4 |
AM27C512-255DIB | UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27512F6 vs AM27C512-255DIB |
AM27C512DI | UVPROM, 64KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | M27512F6 vs AM27C512DI |
27LV512-25I/J | 64K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27512F6 vs 27LV512-25I/J |
SMJ27C512-25J | 64KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | M27512F6 vs SMJ27C512-25J |
AT27C512R-25DM | UVPROM, 64KX8, 250ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | M27512F6 vs AT27C512R-25DM |
TMM27512AD-250 | IC 64K X 8 UVPROM, 250 ns, CDIP28, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | M27512F6 vs TMM27512AD-250 |
TMM27512AD-25 | IC 64K X 8 UVPROM, 250 ns, CDIP28, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | M27512F6 vs TMM27512AD-25 |
AM27C512-250DE | UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27512F6 vs AM27C512-250DE |