Part Details for M24C64-WCS6G/KF by STMicroelectronics
Overview of M24C64-WCS6G/KF by STMicroelectronics
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Part Details for M24C64-WCS6G/KF
M24C64-WCS6G/KF CAD Models
M24C64-WCS6G/KF Part Data Attributes
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M24C64-WCS6G/KF
STMicroelectronics
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Datasheet
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M24C64-WCS6G/KF
STMicroelectronics
EEPROM
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | STMICROELECTRONICS | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2017-09-14 | |
Additional Feature | DATA RETENTION TIME @ 55 DEGREE CENTIGRADE | |
Clock Frequency-Max (fCLK) | 1 MHz | |
Data Retention Time-Min | 200 | |
Endurance | 1200000 Write/Erase Cycles | |
I2C Control Byte | 1010DDDR | |
JESD-30 Code | R-XBCS-B5 | |
Length | 1.073 mm | |
Memory Density | 65536 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 5 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Output Characteristics | OPEN-DRAIN | |
Package Code | CSP | |
Package Equivalence Code | BGA5,3X3,14/8 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP SCALE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.645 mm | |
Serial Bus Type | I2C | |
Standby Current-Max | 0.000003 A | |
Supply Current-Max | 0.0025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.5 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 0.959 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |