Part Details for LP5522TM/NOPB by National Semiconductor Corporation
Overview of LP5522TM/NOPB by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
| LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar |
Part Details for LP5522TM/NOPB
LP5522TM/NOPB CAD Models
LP5522TM/NOPB Part Data Attributes
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LP5522TM/NOPB
National Semiconductor Corporation
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LP5522TM/NOPB
National Semiconductor Corporation
Display Driver, PBGA6
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B6 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA6,2X3,16 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 3.6 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 |