LM28C256-350/B
LSI Corporation
Description: EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32

Overview of LM28C256-350/B by LSI Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage

Available Datasheets

Part # Manufacturer Description Datasheet
ADUCM350BBCZ Analog Devices Impedance measurement with ARM
ADF4350BCPZ-RL7 Analog Devices F-N with high performance inte
ADXL350BCEZ-RL7 Analog Devices Digital Output Three-Axis Acce

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Part Data Attributes for LM28C256-350/B by LSI Corporation

LM28C256-350/B
LSI Corporation
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
Package Description
QCCN, LCC32,.45X.55
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Access Time-Max
350 ns
Additional Feature
AUTOMATIC WRITE;PAGE WRITE
Command User Interface
NO
Data Polling
YES
Endurance
10000 Write/Erase Cycles
JESD-30 Code
R-CQCC-N32
JESD-609 Code
e0
Memory Density
262144 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Page Size
64 words
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00025 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Toggle Bit
NO
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  1. LM28C256-350/B
    LSI Corporation
    EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32
    VS

Alternate Parts for LM28C256-350/B

This table gives cross-reference parts and alternative options found for LM28C256-350/B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LM28C256-350/B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
X28C256EI-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256EI-35
LE28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32 LSI Corporation LM28C256-350/B vs LE28C256-350
5962-8852509YA EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs 5962-8852509YA
X28C256EI-35T1 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256EI-35T1
AM28C256-355LC EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C256-350/B vs AM28C256-355LC
AT28C256-35LM/883 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation LM28C256-350/B vs AT28C256-35LM/883
5962-8852501YX EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs 5962-8852501YX
5962-8852509YX EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 LSI Corporation LM28C256-350/B vs 5962-8852509YX
X28C256GMB-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256GMB-35
AM28C256-355LCB EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C256-350/B vs AM28C256-355LCB
Part Number Description Manufacturer Compare
X28C256E-35T1 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256E-35T1
X28C256EM-35T1 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256EM-35T1
5962-8852509YX EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v LM28C256-350/B vs 5962-8852509YX
5962-8852501YX EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Teledyne e2v LM28C256-350/B vs 5962-8852501YX
X28C256GMB-35 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256GMB-35
LQ28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32 LSI Corporation LM28C256-350/B vs LQ28C256-350
5962-8852501YX EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs 5962-8852501YX
LE28C256-350 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32 LSI Corporation LM28C256-350/B vs LE28C256-350
AM28C256-350LC EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C256-350/B vs AM28C256-350LC
X28C256EI-35T1 EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C256-350/B vs X28C256EI-35T1

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