Datasheets
LH532000BD-1 by: Sharp Corp

MASK ROM, 256KX8, 120ns, CMOS, PDIP40, DIP-40

Part Details for LH532000BD-1 by Sharp Corp

Overview of LH532000BD-1 by Sharp Corp

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Part Details for LH532000BD-1

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LH532000BD-1 Part Data Attributes

LH532000BD-1 Sharp Corp
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LH532000BD-1 Sharp Corp MASK ROM, 256KX8, 120ns, CMOS, PDIP40, DIP-40
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SHARP CORP
Package Description DIP-40
Reach Compliance Code unknown
Access Time-Max 120 ns
JESD-30 Code R-PDIP-T40
JESD-609 Code e0
Length 52 mm
Memory Density 2097152 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 40
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.4 mm
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for LH532000BD-1

This table gives cross-reference parts and alternative options found for LH532000BD-1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LH532000BD-1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
LH532000B-1D-1 MASK ROM, 256KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Sharp Corp LH532000BD-1 vs LH532000B-1D-1
LH532000BD-12 MASK ROM, 256KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Sharp Corp LH532000BD-1 vs LH532000BD-12
KM23C2100H-12 MASK ROM, 256KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Samsung Semiconductor LH532000BD-1 vs KM23C2100H-12
LH532000BD120 MASK ROM, 256KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 Sharp Corp LH532000BD-1 vs LH532000BD120
Part Number Description Manufacturer Compare
AM27C2048-55PI5 OTP ROM, 128KX16, 55ns, CMOS, PDIP40, PLASTIC, DIP-40 Spansion LH532000BD-1 vs AM27C2048-55PI5
AM27C2048-200DI UVPROM, 128KX16, 200ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-200DI
AT27C2048-70PI OTP ROM, 128KX16, 70ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, MS-011AC, DIP-40 Atmel Corporation LH532000BD-1 vs AT27C2048-70PI
AM27C2048-175DC UVPROM, 128KX16, 170ns, CMOS, CDIP40, 0.600 INCH, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-175DC
AM27C2048-200DIB UVPROM, 128KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion LH532000BD-1 vs AM27C2048-200DIB
AM27C2048-55DI5B UVPROM, 128KX16, 55ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-55DI5B
AM27C2048-95DCB UVPROM, 128KX16, 90ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-95DCB
M27C202-200F6 128KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics LH532000BD-1 vs M27C202-200F6
AM27C2048-95DIB UVPROM, 128KX16, 90ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-95DIB
AM27C2048-255DC UVPROM, 128KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD LH532000BD-1 vs AM27C2048-255DC

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