Memory
L8C409NC25
LOGIC Devices Inc
Description: FIFO, 64X9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

Overview of L8C409NC25 by LOGIC Devices Inc

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Part Data Attributes for L8C409NC25 by LOGIC Devices Inc

L8C409NC25
LOGIC Devices Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
20 ns
Cycle Time
40 ns
JESD-30 Code
R-PDIP-T28
Length
37.083 mm
Memory Density
576 bit
Memory IC Type
OTHER FIFO
Memory Width
9
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
28
Number of Words
64 words
Number of Words Code
64
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64X9
Output Characteristics
TOTEM POLE
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. L8C409NC25
    LOGIC Devices Inc
    FIFO, 64X9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28
    VS

Alternate Parts for L8C409NC25

This table gives cross-reference parts and alternative options found for L8C409NC25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L8C409NC25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
L8C409NC35 FIFO, 64X9, 20ns, Asynchronous, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409NC35
L8C409CC35 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CC35
L8C409CC25 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CC25
L8C409CME35 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CME35
L8C409CM25 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CM25
L8C409CME25 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CME25
Part Number Description Manufacturer Compare
CY8C409-15DC FIFO, 64X9, Asynchronous, CMOS, CDIP28, Cypress Semiconductor L8C409NC25 vs CY8C409-15DC
L8C409PC15 FIFO, 64X9, 25ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409PC15
SN74ALS2233AN 64 x 9 asynchronous FIFO memory 28-PDIP 0 to 70 Texas Instruments L8C409NC25 vs SN74ALS2233AN
CD54HCT7030E 64X9 OTHER FIFO, 117ns, PDIP28 Intersil Corporation L8C409NC25 vs CD54HCT7030E
CY8C409-15DMB FIFO, 64X9, Asynchronous, CMOS, CDIP28, Cypress Semiconductor L8C409NC25 vs CY8C409-15DMB
74ACT2708PC 64X9 OTHER FIFO, 34.5ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Texas Instruments L8C409NC25 vs 74ACT2708PC
74AC723DCQR FIFO, 64X9, Synchronous, CMOS, CDIP28, CERAMIC, DIP-28 Fairchild Semiconductor Corporation L8C409NC25 vs 74AC723DCQR
CY7C409-25DMB FIFO, 64X9, Asynchronous, CMOS, CDIP28, Cypress Semiconductor L8C409NC25 vs CY7C409-25DMB
CY7C409A-35PC FIFO, 64X9, 16ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28 Cypress Semiconductor L8C409NC25 vs CY7C409A-35PC
L8C409CM25 FIFO, 64X9, 20ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERDIP-28 LOGIC Devices Inc L8C409NC25 vs L8C409CM25

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