Part Details for L7C170CC25 by LOGIC Devices Inc
Overview of L7C170CC25 by LOGIC Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for L7C170CC25
L7C170CC25 CAD Models
L7C170CC25 Part Data Attributes
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L7C170CC25
LOGIC Devices Inc
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Datasheet
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L7C170CC25
LOGIC Devices Inc
Standard SRAM, 4KX4, 25ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LOGIC DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP22,.3 | |
Pin Count | 22 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
Additional Feature | AUTOMATIC POWER-DOWN | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T22 | |
JESD-609 Code | e0 | |
Length | 27.178 mm | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 4 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 22 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4KX4 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Equivalence Code | DIP22,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.00005 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for L7C170CC25
This table gives cross-reference parts and alternative options found for L7C170CC25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L7C170CC25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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L7C170DC25 | Standard SRAM, 4KX4, 25ns, CMOS, CDIP22, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22 | LOGIC Devices Inc | L7C170CC25 vs L7C170DC25 |