Part Details for L10C11CM30 by LOGIC Devices Inc
Overview of L10C11CM30 by LOGIC Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Part Details for L10C11CM30
L10C11CM30 CAD Models
L10C11CM30 Part Data Attributes
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L10C11CM30
LOGIC Devices Inc
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Datasheet
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L10C11CM30
LOGIC Devices Inc
Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LOGIC DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 | |
Additional Feature | SELECTABLE DELAY LENGTH FROM 3 TO 18 STAGES; ICC SPECIFIED @ 5MHZ | |
Boundary Scan | NO | |
External Data Bus Width | 8 | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 31.75 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Output Data Bus Width | 8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Supply Current-Max | 20 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm | |
uPs/uCs/Peripheral ICs Type | DSP PERIPHERAL, PIPELINE REGISTER |
Alternate Parts for L10C11CM30
This table gives cross-reference parts and alternative options found for L10C11CM30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L10C11CM30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TMC2011AN2C | Pipeline Register, 8-Bit, CMOS, PDIP24, PLASTIC, DIP-24 | Raytheon Semiconductor | L10C11CM30 vs TMC2011AN2C |
TMC2011B2C | Pipeline Register, 8-Bit, CMOS, CDIP24, | Raytheon Semiconductor | L10C11CM30 vs TMC2011B2C |
TMC2011AB2C | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Fairchild Semiconductor Corporation | L10C11CM30 vs TMC2011AB2C |
5962-9679301MLA | Pipeline Register, 8-Bit, CMOS, CDIP24, CERAMIC, DIP-24 | LOGIC Devices Inc | L10C11CM30 vs 5962-9679301MLA |
TMC2011B2C | Shift Register, 18-Bit, CMOS, CDIP24 | TRW Inc | L10C11CM30 vs TMC2011B2C |
5962-8944601LX | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Raytheon Semiconductor | L10C11CM30 vs 5962-8944601LX |