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Overview of KM23V4100DT by Samsung Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
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Computing and Data Storage
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CAD Models for KM23V4100DT by Samsung Semiconductor
Part Data Attributes for KM23V4100DT by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code
|
TSOP2
|
Package Description
|
TSOP2, TSOP44,.46,32
|
Pin Count
|
44
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Access Time-Max
|
120 ns
|
Additional Feature
|
USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY
|
Alternate Memory Width
|
8
|
JESD-30 Code
|
R-PDSO-G40
|
JESD-609 Code
|
e0
|
Length
|
18.41 mm
|
Memory Density
|
4194304 bit
|
Memory IC Type
|
MASK ROM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
40
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
512KX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSOP2
|
Package Equivalence Code
|
TSOP44,.46,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Standby Current-Max
|
0.00003 A
|
Supply Current-Max
|
0.025 mA
|
Supply Voltage-Max (Vsup)
|
3.3 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
DUAL
|
Width
|
10.16 mm
|