Part Details for KM23V4100D by Samsung Semiconductor
Overview of KM23V4100D by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Entertainment and Gaming
Part Details for KM23V4100D
KM23V4100D CAD Models
KM23V4100D Part Data Attributes
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KM23V4100D
Samsung Semiconductor
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Datasheet
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KM23V4100D
Samsung Semiconductor
MASK ROM, 512KX8, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP40,.6 | |
Pin Count | 40 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 120 ns | |
Additional Feature | USER CONFIGURABLE AS 256K X 16; CAN ALSO OPERATE AT 3V TO 3.6V SUPPLY | |
Alternate Memory Width | 8 | |
JESD-30 Code | R-PDIP-T40 | |
JESD-609 Code | e0 | |
Length | 52.42 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP40,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.00003 A | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 3.3 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for KM23V4100D
This table gives cross-reference parts and alternative options found for KM23V4100D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KM23V4100D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MSM534020CRS | MASK ROM, 256KX16, 100ns, CMOS, PDIP40, PLASTIC, DIP-40 | OKI Electric Industry Co Ltd | KM23V4100D vs MSM534020CRS |
GM23C4100A-12 | MASK ROM, 512KX8, 120ns, CMOS, PDIP40, | LG Semicon Co Ltd | KM23V4100D vs GM23C4100A-12 |
HN62454P-10 | MASK ROM, 256KX16, 100ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Hitachi Ltd | KM23V4100D vs HN62454P-10 |
GM23C4100A-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP40, | LG Semicon Co Ltd | KM23V4100D vs GM23C4100A-15 |
HY23V04200D-120 | MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | SK Hynix Inc | KM23V4100D vs HY23V04200D-120 |
KM23C4200D-12 | MASK ROM, 256KX16, 120ns, CMOS, PDIP40, 0.600 INCH, DIP-40 | Samsung Semiconductor | KM23V4100D vs KM23C4200D-12 |
KM23V4200D-15 | MASK ROM, 256KX16, 150ns, CMOS, PDIP40, 0.600 INCH, DIP-40 | Samsung Semiconductor | KM23V4100D vs KM23V4200D-15 |
HN62404P | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Hitachi Ltd | KM23V4100D vs HN62404P |
KM23C4100A-12 | MASK ROM, 512KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Samsung Semiconductor | KM23V4100D vs KM23C4100A-12 |
HN62435P-12 | MASK ROM, 512KX8, 120ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Hitachi Ltd | KM23V4100D vs HN62435P-12 |