Part Details for KM23V4001B-30 by Samsung Semiconductor
Overview of KM23V4001B-30 by Samsung Semiconductor
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Applications
Space Technology
Aerospace and Defense
Part Details for KM23V4001B-30
KM23V4001B-30 CAD Models
KM23V4001B-30 Part Data Attributes
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KM23V4001B-30
Samsung Semiconductor
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Datasheet
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KM23V4001B-30
Samsung Semiconductor
MASK ROM, 512KX8, 300ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP32,.6 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 300 ns | |
JESD-30 Code | R-PDIP-T32 | |
JESD-609 Code | e0 | |
Length | 41.91 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Standby Current-Max | 0.03 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 3.3 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |