Datasheets
K4T1G084QF-BIE60 by: Samsung Semiconductor

DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60

Part Details for K4T1G084QF-BIE60 by Samsung Semiconductor

Overview of K4T1G084QF-BIE60 by Samsung Semiconductor

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Part Details for K4T1G084QF-BIE60

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K4T1G084QF-BIE60 Part Data Attributes

K4T1G084QF-BIE60 Samsung Semiconductor
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K4T1G084QF-BIE60 Samsung Semiconductor DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description TFBGA, BGA60,9X11,32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.45 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B60
Length 9.5 mm
Memory Density 1073741824 bit
Memory IC Type DDR2 DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Organization 128MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 7.5 mm

Alternate Parts for K4T1G084QF-BIE60

This table gives cross-reference parts and alternative options found for K4T1G084QF-BIE60. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4T1G084QF-BIE60, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MT47H128M8HQ-3LIT:E DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HQ-3LIT:E
K4T1G084QD-ZCE60 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, FBGA-60 Samsung Semiconductor K4T1G084QF-BIE60 vs K4T1G084QD-ZCE60
K4T1G084QF-BIE6 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60 Samsung Semiconductor K4T1G084QF-BIE60 vs K4T1G084QF-BIE6
K4T1G084QC-ZLE6 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60 Samsung Semiconductor K4T1G084QF-BIE60 vs K4T1G084QC-ZLE6
HYI18T1G800C2C-3 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, PLASTIC, TFBGA-60 Qimonda AG K4T1G084QF-BIE60 vs HYI18T1G800C2C-3
MT47H128M8HQ-3EL:E DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HQ-3EL:E
K4T1G084QE-HLE6 DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 Samsung Semiconductor K4T1G084QF-BIE60 vs K4T1G084QE-HLE6
MT47H128M8HV-3LIT:E DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HV-3LIT:E
MT47H128M8CF-3AT:H DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8CF-3AT:H
MT47H128M8JN-3IT:H DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 10 MM, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8JN-3IT:H
Part Number Description Manufacturer Compare
MT47H64M8CB-37EAT:B DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA60, 12 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H64M8CB-37EAT:B
MT47H128M8HV-37E:G DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HV-37E:G
MT47H64M8CB-25AT:B DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 12 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H64M8CB-25AT:B
MT47H128M8HQ-3LAT:E DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HQ-3LAT:E
MT47H64M8JN-5ELAT:F DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA60, 8 X 10 MM, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H64M8JN-5ELAT:F
MT47H128M8CF-25 DDR DRAM, Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8CF-25
H5PS1G83EFR-Y5I DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 SK Hynix Inc K4T1G084QF-BIE60 vs H5PS1G83EFR-Y5I
MT47H128M8HV-5EL:E DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8HV-5EL:E
MT47H128M8CF-25LIT:H DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 8 X 10 MM, ROHS COMPLIANT, FBGA-60 Micron Technology Inc K4T1G084QF-BIE60 vs MT47H128M8CF-25LIT:H
K4T1G084QD-ZCF70 DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, FBGA-60 Samsung Semiconductor K4T1G084QF-BIE60 vs K4T1G084QD-ZCF70

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