Datasheets
K4S643233H-HC600 by: Samsung Semiconductor

Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90

Part Details for K4S643233H-HC600 by Samsung Semiconductor

Overview of K4S643233H-HC600 by Samsung Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for K4S643233H-HC600

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K4S643233H-HC600 Part Data Attributes

K4S643233H-HC600 Samsung Semiconductor
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K4S643233H-HC600 Samsung Semiconductor Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description LFBGA,
Pin Count 90
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B90
Length 13 mm
Memory Density 67108864 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 90
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Organization 2MX32
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for K4S643233H-HC600

This table gives cross-reference parts and alternative options found for K4S643233H-HC600. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4S643233H-HC600, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K4S643233H-HF600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HF600
K4S643233H-FL600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-FL600
K4S643233H-FC600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-FC600
K4S643233H-FF600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-FF600
K4S643233H-FN600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-FN600
K4S643233H-HE600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HE600
K4S643233H-HN600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HN600
K4S643233H-FE600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-FE600
K4S643233H-HL600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HL600
K4S643233H-HG600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HG600
Part Number Description Manufacturer Compare
W9825G2DB75E Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFPGA-90 Winbond Electronics Corp K4S643233H-HC600 vs W9825G2DB75E
K4S643233H-HC1H0 Synchronous DRAM, 2MX32, 7ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233H-HC1H0
K4S643233E-SN80 Synchronous DRAM, 2MX32, 6ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643233E-SN80
HY5V62CF-S Synchronous DRAM, 2GX32, 6ns, CMOS, PBGA90, 11 X 13 MM, 0.80 MM PITCH, FBGA-90 SK Hynix Inc K4S643233H-HC600 vs HY5V62CF-S
M2L64S50DWG-6L Synchronous DRAM, 2MX32, 7ns, CMOS, PBGA90, BGA-90 Mitsubishi Electric K4S643233H-HC600 vs M2L64S50DWG-6L
IS42S32200L-6BLI Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, MO-207, TFBGA-90 Integrated Silicon Solution Inc K4S643233H-HC600 vs IS42S32200L-6BLI
MT48LC2M32B2B5-55IT:G Synchronous DRAM, Micron Technology Inc K4S643233H-HC600 vs MT48LC2M32B2B5-55IT:G
K4S643234E-SE10 Synchronous DRAM, 2MX32, 6ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S643234E-SE10
K4S64323LH-HC600 Synchronous DRAM, 2MX32, 5.4ns, CMOS, PBGA90, LEAD FREE, FBGA-90 Samsung Semiconductor K4S643233H-HC600 vs K4S64323LH-HC600
MT48V2M32LFFC-8IT Synchronous DRAM, 2MX32, 7ns, CMOS, PBGA90, 11 X 13 MM, PLASTIC, FBGA-90 Micron Technology Inc K4S643233H-HC600 vs MT48V2M32LFFC-8IT

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