Datasheets
K4M56323PG-HE900 by: Samsung Semiconductor

Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, LEAD FREE, FBGA-90

Part Details for K4M56323PG-HE900 by Samsung Semiconductor

Overview of K4M56323PG-HE900 by Samsung Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for K4M56323PG-HE900

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K4M56323PG-HE900 Part Data Attributes

K4M56323PG-HE900 Samsung Semiconductor
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K4M56323PG-HE900 Samsung Semiconductor Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, LEAD FREE, FBGA-90
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description VFBGA, BGA90,9X15,32
Pin Count 90
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 111 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PBGA-B90
Length 13 mm
Memory Density 268435456 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 32
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 90
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 8MX32
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA90,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 4096
Seated Height-Max 1 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.0003 A
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for K4M56323PG-HE900

This table gives cross-reference parts and alternative options found for K4M56323PG-HE900. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4M56323PG-HE900, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K4M56323PG-HE90 Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-HE90
K4M56323PG-HG90T Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-HG90T
K4M56323PG-FE90T Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-FE90T
K4M56323PG-HG90 Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-HG90
K4M56323PG-HE90T Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-HE90T
K4M56323PG-FG90T Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-FG90T
K4M56323PG-FG90 Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-FG90
K4M56323PG-FE90 Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323PG-FE90
Part Number Description Manufacturer Compare
K4M56323LE-ML80 Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323LE-ML80
IS42S32800G-75EBI Synchronous DRAM, 8MX32, 5.5ns, CMOS, PBGA90, 8 X 13 MM, MO-207, TFBGA-90 Integrated Silicon Solution Inc K4M56323PG-HE900 vs IS42S32800G-75EBI
MT46H8M32LFB5-75IT:A DDR DRAM, 8MX32, 6ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, PLASTIC, VFBGA-90 Micron Technology Inc K4M56323PG-HE900 vs MT46H8M32LFB5-75IT:A
MT48H8M32LFB5-75 Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, GREEN, PLASTIC, VFBGA-90 Micron Technology Inc K4M56323PG-HE900 vs MT48H8M32LFB5-75
HY57W2A3220T-SC Synchronous DRAM, 4MX32, 7ns, CMOS, PDSO86, 0.400 X 0.875 INCH, 0.50 MM PITCH, TSOP2-86 SK Hynix Inc K4M56323PG-HE900 vs HY57W2A3220T-SC
MT48H8M32LFF5-8 Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, 8 X 13 MM, VFBGA-90 Micron Technology Inc K4M56323PG-HE900 vs MT48H8M32LFF5-8
K4M56323LE-MN1L Synchronous DRAM, 8MX32, 7ns, CMOS, PBGA90, FBGA-90 Samsung Semiconductor K4M56323PG-HE900 vs K4M56323LE-MN1L
K4S283233E-DG1H0 Synchronous DRAM, 4MX32, 7ns, CMOS, PBGA90, 11 X 13 MM, LEAD FREE, FBGA-90 Samsung Semiconductor K4M56323PG-HE900 vs K4S283233E-DG1H0
EDS1232JCBH-75-E Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, ROHS COMPLIANT, FBGA-90 Elpida Memory Inc K4M56323PG-HE900 vs EDS1232JCBH-75-E
IS43LR32800D-6BL DDR DRAM, 8MX32, 5.5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, LEAD FREE, MO-207, TFBGA-90 Integrated Silicon Solution Inc K4M56323PG-HE900 vs IS43LR32800D-6BL

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