Part Details for K3P5V1000F-DC10 by Samsung Semiconductor
Overview of K3P5V1000F-DC10 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ADC1038CIWM | Rochester Electronics LLC | ADC, Successive Approximation, 10-Bit, 1 Func, 8 Channel, Serial Access, PDSO20, SOP-20 | |
| ADC1005CCJ | Rochester Electronics LLC | ADC1005 - A/D Converter | |
| TDC1044AR4C | Rochester Electronics LLC | ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PQCC20, PLASTIC, LCC-20 |
Part Details for K3P5V1000F-DC10
K3P5V1000F-DC10 CAD Models
K3P5V1000F-DC10 Part Data Attributes
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K3P5V1000F-DC10
Samsung Semiconductor
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Datasheet
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K3P5V1000F-DC10
Samsung Semiconductor
MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP42,.6 | |
| Pin Count | 42 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 100 ns | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | R-PDIP-T42 | |
| JESD-609 Code | e0 | |
| Length | 52.42 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 42 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP42,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for K3P5V1000F-DC10
This table gives cross-reference parts and alternative options found for K3P5V1000F-DC10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K3P5V1000F-DC10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K3P5V1000F-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs K3P5V1000F-DC100 |
| K3P5U1000D-DC10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs K3P5U1000D-DC10 |
| K3N5V1000E-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs K3N5V1000E-DC100 |
| MR27V1652E-XXRA | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | OKI Electric Industry Co Ltd | K3P5V1000F-DC10 vs MR27V1652E-XXRA |
| K3N5U1000D-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs K3N5U1000D-DC100 |
| K3N5V1000F-DC100 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs K3N5V1000F-DC100 |
| KM23V16000D-10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs KM23V16000D-10 |
| KM23V16005D-10 | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, DIP-42 | Samsung Semiconductor | K3P5V1000F-DC10 vs KM23V16005D-10 |
| MX23L1610PC-10G | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, LEAD FREE, PLASTIC, DIP-42 | Macronix International Co Ltd | K3P5V1000F-DC10 vs MX23L1610PC-10G |
| MR27V1652E-XXRA | MASK ROM, 1MX16, 100ns, CMOS, PDIP42, 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-42 | LAPIS Semiconductor Co Ltd | K3P5V1000F-DC10 vs MR27V1652E-XXRA |