Datasheets
IS61DDP2B22M18C1-500B4L by: Integrated Silicon Solution Inc

DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165

Part Details for IS61DDP2B22M18C1-500B4L by Integrated Silicon Solution Inc

Overview of IS61DDP2B22M18C1-500B4L by Integrated Silicon Solution Inc

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Part Details for IS61DDP2B22M18C1-500B4L

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IS61DDP2B22M18C1-500B4L Part Data Attributes

IS61DDP2B22M18C1-500B4L Integrated Silicon Solution Inc
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IS61DDP2B22M18C1-500B4L Integrated Silicon Solution Inc DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description LBGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX18
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 13 mm

Alternate Parts for IS61DDP2B22M18C1-500B4L

This table gives cross-reference parts and alternative options found for IS61DDP2B22M18C1-500B4L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDP2B22M18C1-500B4L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS61QDPB42M18B-500B4 DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61QDPB42M18B-500B4
IS61DDP2B21M36C-500B4 DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, FBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDP2B21M36C-500B4
IS61DDPB22M18C-500B4 DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDPB22M18C-500B4
IS61QDPB41M36C2-500B4 DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61QDPB41M36C2-500B4
IS61DDPB21M36C1-500B4 DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDPB21M36C1-500B4
IS61QDPB42M18C1-500B4 DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61QDPB42M18C1-500B4
IS61DDP2B21M36C2-500B4L DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, FBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDP2B21M36C2-500B4L
IS61DDPB41M36C-500B4I DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDPB41M36C-500B4I
IS61DDPB21M36C2-500B4I DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61DDPB21M36C2-500B4I
IS61QDPB41M36C-500B4L DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDP2B22M18C1-500B4L vs IS61QDPB41M36C-500B4L

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