ICE5LP2K-SWG36ITR50
Lattice Semiconductor Corporation
Description: Field Programmable Gate Array,

Overview of ICE5LP2K-SWG36ITR50 by Lattice Semiconductor Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 1 listing )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 0 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Price & Stock for ICE5LP2K-SWG36ITR50 by Lattice Semiconductor Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # 220-1928-1-ND
DigiKey IC FPGA 26 I/O 36WLCSP Min Qty: 1 Lead time: 16 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 1
In Stock
  • 1 $4.2500
$4.2500 Buy Now

CAD Models for ICE5LP2K-SWG36ITR50 by Lattice Semiconductor Corporation
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Part Data Attributes for ICE5LP2K-SWG36ITR50 by Lattice Semiconductor Corporation

ICE5LP2K-SWG36ITR50
Lattice Semiconductor Corporation
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
Package Description
,
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Combinatorial Delay of a CLB-Max
9 ns
JESD-30 Code
S-PBGA-B36
Length
2.078 mm
Moisture Sensitivity Level
1
Number of CLBs
256
Number of Inputs
26
Number of Logic Cells
2048
Number of Outputs
26
Number of Terminals
36
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
256 CLBS
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
BGA36,6X6,14
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
0.491 mm
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
0.35 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
2.078 mm
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