Datasheets
HYB39S256800DE-7.5 by: Infineon Technologies AG

Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54

Part Details for HYB39S256800DE-7.5 by Infineon Technologies AG

Overview of HYB39S256800DE-7.5 by Infineon Technologies AG

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Applications Computing and Data Storage

Part Details for HYB39S256800DE-7.5

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HYB39S256800DE-7.5 Part Data Attributes

HYB39S256800DE-7.5 Infineon Technologies AG
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HYB39S256800DE-7.5 Infineon Technologies AG Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 54
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G54
Length 22.22 mm
Memory Density 268435456 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 54
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX8
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm

Alternate Parts for HYB39S256800DE-7.5

This table gives cross-reference parts and alternative options found for HYB39S256800DE-7.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB39S256800DE-7.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY57V56820AT-H Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 SK Hynix Inc HYB39S256800DE-7.5 vs HY57V56820AT-H
W982508AH-75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Winbond Electronics Corp HYB39S256800DE-7.5 vs W982508AH-75
V54C3256804VDUI7I Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VDUI7I
K4S560832B-TL75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 Samsung Semiconductor HYB39S256800DE-7.5 vs K4S560832B-TL75
V54C3256804VHLI7PC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VHLI7PC
V54C3256804VHUI7IPC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VHUI7IPC
W982508AH-7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Winbond Electronics Corp HYB39S256800DE-7.5 vs W982508AH-7
MT48LC32M8A2TG-75AT:D Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 Micron Technology Inc HYB39S256800DE-7.5 vs MT48LC32M8A2TG-75AT:D
TC59SM808CFTL-70 IC 32M X 8 SYNCHRONOUS DRAM, 5.4 ns, PDSO54, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-54, Dynamic RAM Toshiba America Electronic Components HYB39S256800DE-7.5 vs TC59SM808CFTL-70
K4S560832E-UC750 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-54 Samsung Semiconductor HYB39S256800DE-7.5 vs K4S560832E-UC750
Part Number Description Manufacturer Compare
H57V2582GTR-60J Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54 SK Hynix Inc HYB39S256800DE-7.5 vs H57V2582GTR-60J
V54C3256804VDUT7IPC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VDUT7IPC
IS42S83200G-7TL Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, TSOP2-54 Integrated Silicon Solution Inc HYB39S256800DE-7.5 vs IS42S83200G-7TL
V54C3256804VDUE7IPC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VDUE7IPC
K4S560832A-TC75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 Samsung Semiconductor HYB39S256800DE-7.5 vs K4S560832A-TC75
V54C3256804VDLT7I Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VDLT7I
W982508BH-75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Winbond Electronics Corp HYB39S256800DE-7.5 vs W982508BH-75
MT48LC32M8A2TG-75:D Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 Micron Technology Inc HYB39S256800DE-7.5 vs MT48LC32M8A2TG-75:D
V54C3256804VDLE6I Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-54 ProMOS Technologies Inc HYB39S256800DE-7.5 vs V54C3256804VDLE6I
HYI39S256800FE-7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 Qimonda AG HYB39S256800DE-7.5 vs HYI39S256800FE-7

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