There are no models available for this part yet.
Overview of HYB25D256161CE-4 by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for HYB25D256161CE-4 by Infineon Technologies AG
Part Data Attributes for HYB25D256161CE-4 by Infineon Technologies AG
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
|
|
Part Package Code
|
TSOP2
|
|
Package Description
|
TSSOP, TSSOP66,.46
|
|
Pin Count
|
66
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.24
|
|
Access Mode
|
FOUR BANK PAGE BURST
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|
Access Time-Max
|
0.6 ns
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Additional Feature
|
AUTO/SELF REFRESH
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|
Clock Frequency-Max (fCLK)
|
250 MHz
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I/O Type
|
COMMON
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Interleaved Burst Length
|
2,4,8
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JESD-30 Code
|
R-PDSO-G66
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|
JESD-609 Code
|
e3
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Length
|
22.22 mm
|
|
Memory Density
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268435456 bit
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Memory IC Type
|
DDR1 DRAM
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|
Memory Width
|
16
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Number of Functions
|
1
|
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Number of Ports
|
1
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Number of Terminals
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66
|
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Number of Words
|
16777216 words
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|
Number of Words Code
|
16000000
|
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Operating Mode
|
SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
|
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Operating Temperature-Min
|
|
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Organization
|
16MX16
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Output Characteristics
|
3-STATE
|
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Package Body Material
|
PLASTIC/EPOXY
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Package Code
|
TSSOP
|
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Package Equivalence Code
|
TSSOP66,.46
|
|
Package Shape
|
RECTANGULAR
|
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Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Qualification Status
|
Not Qualified
|
|
Refresh Cycles
|
8192
|
|
Seated Height-Max
|
1.2 mm
|
|
Self Refresh
|
YES
|
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Sequential Burst Length
|
2,4,8
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Standby Current-Max
|
0.006 A
|
|
Supply Current-Max
|
0.315 mA
|
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Supply Voltage-Max (Vsup)
|
2.7 V
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Supply Voltage-Min (Vsup)
|
2.5 V
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|
Supply Voltage-Nom (Vsup)
|
2.6 V
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Surface Mount
|
YES
|
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Technology
|
CMOS
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Temperature Grade
|
COMMERCIAL
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|
Terminal Finish
|
MATTE TIN
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|
Terminal Form
|
GULL WING
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Terminal Pitch
|
0.65 mm
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Terminal Position
|
DUAL
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Width
|
10.16 mm
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Alternate Parts for HYB25D256161CE-4
This table gives cross-reference parts and alternative options found for HYB25D256161CE-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB25D256161CE-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HYB25D256163CE-4 | DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 | Qimonda AG | HYB25D256161CE-4 vs HYB25D256163CE-4 |
| HYB25D256163CE-4 | DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 | Infineon Technologies AG | HYB25D256161CE-4 vs HYB25D256163CE-4 |