Datasheets
HY5DU56822ELFP-KI by: SK Hynix Inc

DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60

Part Details for HY5DU56822ELFP-KI by SK Hynix Inc

Overview of HY5DU56822ELFP-KI by SK Hynix Inc

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Applications Consumer Electronics Computing and Data Storage

Part Details for HY5DU56822ELFP-KI

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HY5DU56822ELFP-KI Part Data Attributes

HY5DU56822ELFP-KI SK Hynix Inc
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HY5DU56822ELFP-KI SK Hynix Inc DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TBGA,
Pin Count 60
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.75 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60
JESD-609 Code e1
Length 13 mm
Memory Density 268435456 bit
Memory IC Type DDR1 DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.17 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for HY5DU56822ELFP-KI

This table gives cross-reference parts and alternative options found for HY5DU56822ELFP-KI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5DU56822ELFP-KI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
V58C2256804SCLS7I DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, MO-233, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SCLS7I
V58C2256804SAJ-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, GREEN, MO-233, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SAJ-7
V58C2256804SAP-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, GREEN, M0-233, DIE-STACKED, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SAP-7
HY5DU56822ELFP-LI DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc HY5DU56822ELFP-KI vs HY5DU56822ELFP-LI
V58C2256804SALS-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, MO-233, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SALS-7
V58C2256804SCF7I DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, MO-233, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SCF7I
V58C2256804SAZ-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, M0-233, DIE-STACKED, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SAZ-7
HY5DU56822ELFP-HI DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc HY5DU56822ELFP-KI vs HY5DU56822ELFP-HI
V58C2256804SALP-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, GREEN, M0-233, DIE-STACKED, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SALP-7
V58C2256804SAR-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, M0-233, DIE-STACKED, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SAR-7
Part Number Description Manufacturer Compare
MT46V32M8P-75ZIT DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8P-75ZIT
HY5DU56822FTP-L DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822ELFP-KI vs HY5DU56822FTP-L
MT46V32M8P-75LIT DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8P-75LIT
MT46V32M8BJ-75HIT DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8BJ-75HIT
MT46V32M8TG-75ELITH 32MX8 DDR DRAM, 0.75ns, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8TG-75ELITH
MT46V32M8BJ-75EL DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8BJ-75EL
V58C2256804SALD-7 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SALD-7
V58C2256804SBS7 DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, MO-233, FBGA-60 ProMOS Technologies Inc HY5DU56822ELFP-KI vs V58C2256804SBS7
EDD2508AETA-7A-E DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, ROHS COMPLIANT, PLASTIC, TSOP2-66 Elpida Memory Inc HY5DU56822ELFP-KI vs EDD2508AETA-7A-E
MT46V32M8TG-75ZES:C DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822ELFP-KI vs MT46V32M8TG-75ZES:C

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