Part Details for HY27SA081G1M-TPEB by SK Hynix Inc
Overview of HY27SA081G1M-TPEB by SK Hynix Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 89KTPEB383-QFP | Renesas Electronics Corporation | System Development Kit for the PEB383 PCIe to PCI Bridge | |
| 89KTPEB383-QFN | Renesas Electronics Corporation | System Development Kit for the PEB383 PCIe to PCI Bridge |
Part Details for HY27SA081G1M-TPEB
HY27SA081G1M-TPEB CAD Models
HY27SA081G1M-TPEB Part Data Attributes
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HY27SA081G1M-TPEB
SK Hynix Inc
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Datasheet
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HY27SA081G1M-TPEB
SK Hynix Inc
Flash, 128MX8, 12000ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SK HYNIX INC | |
| Part Package Code | TSOP1 | |
| Package Description | TSOP1, | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 12000 ns | |
| JESD-30 Code | R-PDSO-G48 | |
| JESD-609 Code | e6 | |
| Length | 18.4 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 128MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 1.8 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Type | SLC NAND TYPE | |
| Width | 12 mm |
Alternate Parts for HY27SA081G1M-TPEB
This table gives cross-reference parts and alternative options found for HY27SA081G1M-TPEB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY27SA081G1M-TPEB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY27SA081G1M-TEP | Flash, 128MX8, 12000ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-TEP |
| HY27SA081G1M-VPEB | Flash, 128MX8, 12000ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, LEAD FREE, WSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-VPEB |
| HY27SA081G1M-VPES | Flash, 128MX8, 12000ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, LEAD FREE, WSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-VPES |
| HY27SA081G1M-TEB | Flash, 128MX8, 12000ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-TEB |
| HY27SA081G1M-TPES | Flash, 128MX8, 12000ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-TPES |
| HY27SA081G1M-VEP | Flash, 128MX8, 12000ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, WSOP1-48 | SK Hynix Inc | HY27SA081G1M-TPEB vs HY27SA081G1M-VEP |