Datasheets
HY234000P-150 by: SK Hynix Inc

MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Part Details for HY234000P-150 by SK Hynix Inc

Overview of HY234000P-150 by SK Hynix Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for HY234000P-150

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HY234000P-150 Part Data Attributes

HY234000P-150 SK Hynix Inc
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HY234000P-150 SK Hynix Inc MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 150 ns
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 42.037 mm
Memory Density 4194304 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HY234000P-150

This table gives cross-reference parts and alternative options found for HY234000P-150. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY234000P-150, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
KM23C4001H-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4001H-15
HN62315BP-15 512KX8 MASK PROM, 150ns, PDIP32, PLASTIC, DIP-32 Renesas Electronics Corporation HY234000P-150 vs HN62315BP-15
LH534K00D-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp HY234000P-150 vs LH534K00D-15
KM23C4000H-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4000H-15
MX23C4000PC-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd HY234000P-150 vs MX23C4000PC-15
MS314001-150PC MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Mosel Vitelic Corporation HY234000P-150 vs MS314001-150PC
TC534000AP IC 512K X 8 MASK PROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components HY234000P-150 vs TC534000AP
AM27X040-155PI MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD HY234000P-150 vs AM27X040-155PI
KM23C4001A-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4001A-15
KM23C4001B-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4001B-15
Part Number Description Manufacturer Compare
AM27X040-155PC MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD HY234000P-150 vs AM27X040-155PC
KM23C4000-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4000-15
MX23C4000PC-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd HY234000P-150 vs MX23C4000PC-15
TC534000AP IC 512K X 8 MASK PROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM Toshiba America Electronic Components HY234000P-150 vs TC534000AP
M5M23401AP MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Mitsubishi Electric HY234000P-150 vs M5M23401AP
KM23C4000B-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4000B-15
AM27X040-155PI MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD HY234000P-150 vs AM27X040-155PI
HY234001P-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 SK Hynix Inc HY234000P-150 vs HY234001P-15
HN62334BP-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HY234000P-150 vs HN62334BP-15
KM23C4001B-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HY234000P-150 vs KM23C4001B-15

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