Part Details for HY234000P-150 by SK Hynix Inc
Overview of HY234000P-150 by SK Hynix Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HY234000P-150
HY234000P-150 CAD Models
HY234000P-150 Part Data Attributes
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HY234000P-150
SK Hynix Inc
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Datasheet
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HY234000P-150
SK Hynix Inc
MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SK HYNIX INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP32,.6 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 150 ns | |
JESD-30 Code | R-PDIP-T32 | |
JESD-609 Code | e0 | |
Length | 42.037 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.826 mm | |
Standby Current-Max | 0.00005 A | |
Supply Current-Max | 0.04 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for HY234000P-150
This table gives cross-reference parts and alternative options found for HY234000P-150. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY234000P-150, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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KM23C4001H-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | HY234000P-150 vs KM23C4001H-15 |
HN62315BP-15 | 512KX8 MASK PROM, 150ns, PDIP32, PLASTIC, DIP-32 | Renesas Electronics Corporation | HY234000P-150 vs HN62315BP-15 |
LH534K00D-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Sharp Corp | HY234000P-150 vs LH534K00D-15 |
KM23C4000H-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | HY234000P-150 vs KM23C4000H-15 |
MX23C4000PC-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | HY234000P-150 vs MX23C4000PC-15 |
MS314001-150PC | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Mosel Vitelic Corporation | HY234000P-150 vs MS314001-150PC |
TC534000AP | IC 512K X 8 MASK PROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM | Toshiba America Electronic Components | HY234000P-150 vs TC534000AP |
AM27X040-155PI | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 | AMD | HY234000P-150 vs AM27X040-155PI |
KM23C4001A-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | HY234000P-150 vs KM23C4001A-15 |
KM23C4001B-15 | MASK ROM, 512KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Samsung Semiconductor | HY234000P-150 vs KM23C4001B-15 |