Datasheets
HN62314BP-20 by:

MASK ROM, 512KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32

Part Details for HN62314BP-20 by Hitachi Ltd

Overview of HN62314BP-20 by Hitachi Ltd

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for HN62314BP-20

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HN62314BP-20 Part Data Attributes

HN62314BP-20 Hitachi Ltd
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HN62314BP-20 Hitachi Ltd MASK ROM, 512KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 41.9 mm
Memory Density 4194304 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.00003 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN62314BP-20

This table gives cross-reference parts and alternative options found for HN62314BP-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN62314BP-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
KM23C4000-20 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HN62314BP-20 vs KM23C4000-20
RP234096 MASK ROM, 512KX8, 200ns, NMOS, PDIP32, PLASTIC, DIP-32 Ricoh Electronic Devices Co Ltd HN62314BP-20 vs RP234096
MN234003 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Panasonic Electronic Components HN62314BP-20 vs MN234003
HN62315BP-20 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd HN62314BP-20 vs HN62315BP-20
HN62315BP-20 512KX8 MASK PROM, 200ns, PDIP32, PLASTIC, DIP-32 Renesas Electronics Corporation HN62314BP-20 vs HN62315BP-20
LH534100BD-20 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp HN62314BP-20 vs LH534100BD-20
MB834000A-20P MASK ROM, 512KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 FUJITSU Semiconductor Limited HN62314BP-20 vs MB834000A-20P
KM23C4001-20 MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor HN62314BP-20 vs KM23C4001-20
HN62304BP MASK ROM, 512KX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HN62314BP-20 vs HN62304BP
Part Number Description Manufacturer Compare
HN62315BP-15 MASK ROM, 512KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd HN62314BP-20 vs HN62315BP-15
HN27C4001G-10 UVPROM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd HN62314BP-20 vs HN27C4001G-10
AM29F040B-150PCB Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 AMD HN62314BP-20 vs AM29F040B-150PCB
AM29F040B-150PIB Flash, 512KX8, 150ns, PDIP32, PLASTIC, DIP-32 AMD HN62314BP-20 vs AM29F040B-150PIB
AM29F004BT-55PI Flash, 512KX8, 55ns, PDIP32, PLASTIC, DIP-32 AMD HN62314BP-20 vs AM29F004BT-55PI
AM29F004BT-120PI Flash, 512KX8, 120ns, PDIP32, PLASTIC, DIP-32 AMD HN62314BP-20 vs AM29F004BT-120PI
FTE512S8N-13I 512KX8 EEPROM 5V, 135ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd HN62314BP-20 vs FTE512S8N-13I
M29F040-150PB/T Flash, 512KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Thales Group HN62314BP-20 vs M29F040-150PB/T
WE512K8150CM EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN62314BP-20 vs WE512K8150CM
FTE512S8N-17C 512KX8 EEPROM 5V, 170ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Force Technologies Ltd HN62314BP-20 vs FTE512S8N-17C

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