Part Details for HM365767BN-5 by Temic Semiconductors
Overview of HM365767BN-5 by Temic Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for HM365767BN-5
HM365767BN-5 CAD Models
HM365767BN-5 Part Data Attributes
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HM365767BN-5
Temic Semiconductors
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Datasheet
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HM365767BN-5
Temic Semiconductors
Standard SRAM, 16KX1, 55ns, CMOS, PDIP20,
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEMIC SEMICONDUCTORS | |
Reach Compliance Code | unknown | |
Access Time-Max | 55 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PDIP-T20 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 20 | |
Number of Words | 16384 words | |
Number of Words Code | 16000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16KX1 | |
Output Characteristics | 3-STATE | |
Output Enable | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP20,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.03 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.09 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |
Alternate Parts for HM365767BN-5
This table gives cross-reference parts and alternative options found for HM365767BN-5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM365767BN-5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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HM3-6504S-9+ | SRAM | Renesas Electronics Corporation | HM365767BN-5 vs HM3-6504S-9+ |
AM2167-35LCB | Standard SRAM, 16KX1, 30ns, NMOS, CQCC20, CERAMIC, LCC-20 | AMD | HM365767BN-5 vs AM2167-35LCB |
6167LA35P | Standard SRAM, 16KX1, 35ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Integrated Device Technology Inc | HM365767BN-5 vs 6167LA35P |
HM1-65767BKDB | Standard SRAM, 16KX1, 35ns, CMOS, CDIP20 | Matra MHS | HM365767BN-5 vs HM1-65767BKDB |
AM92L44DDC | Standard SRAM, 4KX1, 250ns, MOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | HM365767BN-5 vs AM92L44DDC |
HM165767BM-2/883:D | Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, PACKAGE-20 | Atmel Corporation | HM365767BN-5 vs HM165767BM-2/883:D |
HM4-65262DB | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Matra MHS | HM365767BN-5 vs HM4-65262DB |
UPB10480B-15 | Standard SRAM, 16KX1, 15ns, ECL10K, CDFP20, CERAMIC, FP-20 | NEC Electronics America Inc | HM365767BN-5 vs UPB10480B-15 |
IDT6167SA35Y8 | Standard SRAM, 16KX1, 35ns, CMOS, PDSO20, 0.300 INCH, SOJ-20 | Integrated Device Technology Inc | HM365767BN-5 vs IDT6167SA35Y8 |
AM2147-45LC | Standard SRAM, 4KX1, 45ns, NMOS, CQCC18, CERAMIC, LCC-18 | AMD | HM365767BN-5 vs AM2147-45LC |