Datasheets
HM365767BN-5 by:

Standard SRAM, 16KX1, 55ns, CMOS, PDIP20,

Part Details for HM365767BN-5 by Temic Semiconductors

Overview of HM365767BN-5 by Temic Semiconductors

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Applications Computing and Data Storage

Part Details for HM365767BN-5

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HM365767BN-5 Part Data Attributes

HM365767BN-5 Temic Semiconductors
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HM365767BN-5 Temic Semiconductors Standard SRAM, 16KX1, 55ns, CMOS, PDIP20,
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS
Reach Compliance Code unknown
Access Time-Max 55 ns
I/O Type SEPARATE
JESD-30 Code R-PDIP-T20
JESD-609 Code e0
Memory Density 16384 bit
Memory IC Type STANDARD SRAM
Memory Width 1
Number of Functions 1
Number of Ports 1
Number of Terminals 20
Number of Words 16384 words
Number of Words Code 16000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16KX1
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.09 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for HM365767BN-5

This table gives cross-reference parts and alternative options found for HM365767BN-5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM365767BN-5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HM3-6504S-9+ SRAM Renesas Electronics Corporation HM365767BN-5 vs HM3-6504S-9+
AM2167-35LCB Standard SRAM, 16KX1, 30ns, NMOS, CQCC20, CERAMIC, LCC-20 AMD HM365767BN-5 vs AM2167-35LCB
6167LA35P Standard SRAM, 16KX1, 35ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 Integrated Device Technology Inc HM365767BN-5 vs 6167LA35P
HM1-65767BKDB Standard SRAM, 16KX1, 35ns, CMOS, CDIP20 Matra MHS HM365767BN-5 vs HM1-65767BKDB
AM92L44DDC Standard SRAM, 4KX1, 250ns, MOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 AMD HM365767BN-5 vs AM92L44DDC
HM165767BM-2/883:D Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, PACKAGE-20 Atmel Corporation HM365767BN-5 vs HM165767BM-2/883:D
HM4-65262DB Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 Matra MHS HM365767BN-5 vs HM4-65262DB
UPB10480B-15 Standard SRAM, 16KX1, 15ns, ECL10K, CDFP20, CERAMIC, FP-20 NEC Electronics America Inc HM365767BN-5 vs UPB10480B-15
IDT6167SA35Y8 Standard SRAM, 16KX1, 35ns, CMOS, PDSO20, 0.300 INCH, SOJ-20 Integrated Device Technology Inc HM365767BN-5 vs IDT6167SA35Y8
AM2147-45LC Standard SRAM, 4KX1, 45ns, NMOS, CQCC18, CERAMIC, LCC-18 AMD HM365767BN-5 vs AM2147-45LC

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