Part Details for HM165767BM-2/883:D by Atmel Corporation
Overview of HM165767BM-2/883:D by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HM165767BM-2/883:D
HM165767BM-2/883:D CAD Models
HM165767BM-2/883:D Part Data Attributes
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HM165767BM-2/883:D
Atmel Corporation
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Datasheet
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HM165767BM-2/883:D
Atmel Corporation
Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, PACKAGE-20
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Package Description | DIP, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 45 ns | |
| JESD-30 Code | R-GDIP-T20 | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 16KX1 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for HM165767BM-2/883:D
This table gives cross-reference parts and alternative options found for HM165767BM-2/883:D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM165767BM-2/883:D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HM3-6504S-9+ | SRAM | Renesas Electronics Corporation | HM165767BM-2/883:D vs HM3-6504S-9+ |
| AM2167-35LCB | Standard SRAM, 16KX1, 30ns, NMOS, CQCC20, CERAMIC, LCC-20 | AMD | HM165767BM-2/883:D vs AM2167-35LCB |
| 6167LA35P | Standard SRAM, 16KX1, 35ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Integrated Device Technology Inc | HM165767BM-2/883:D vs 6167LA35P |
| HM1-65767BKDB | Standard SRAM, 16KX1, 35ns, CMOS, CDIP20 | Matra MHS | HM165767BM-2/883:D vs HM1-65767BKDB |
| AM92L44DDC | Standard SRAM, 4KX1, 250ns, MOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | AMD | HM165767BM-2/883:D vs AM92L44DDC |
| HM4-65262DB | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Matra MHS | HM165767BM-2/883:D vs HM4-65262DB |
| UPB10480B-15 | Standard SRAM, 16KX1, 15ns, ECL10K, CDFP20, CERAMIC, FP-20 | NEC Electronics America Inc | HM165767BM-2/883:D vs UPB10480B-15 |
| IDT6167SA35Y8 | Standard SRAM, 16KX1, 35ns, CMOS, PDSO20, 0.300 INCH, SOJ-20 | Integrated Device Technology Inc | HM165767BM-2/883:D vs IDT6167SA35Y8 |
| AM2147-45LC | Standard SRAM, 4KX1, 45ns, NMOS, CQCC18, CERAMIC, LCC-18 | AMD | HM165767BM-2/883:D vs AM2147-45LC |
| L7C167KC8 | Standard SRAM, 16KX1, 8ns, CMOS, CQCC20, 0.290 X 0.425 INCH, CERAMIC, LCC-20 | LOGIC Devices Inc | HM165767BM-2/883:D vs L7C167KC8 |