Part Details for HM3-6514B-9 by Rochester Electronics LLC
Overview of HM3-6514B-9 by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| R5F56514BDLJ#20 | Renesas Electronics Corporation | 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities | |
| R5F56514BDLK#20 | Renesas Electronics Corporation | 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities | |
| R5F56514BGBP#20 | Renesas Electronics Corporation | 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities |
Part Details for HM3-6514B-9
HM3-6514B-9 CAD Models
HM3-6514B-9 Part Data Attributes
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HM3-6514B-9
Rochester Electronics LLC
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Datasheet
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HM3-6514B-9
Rochester Electronics LLC
Standard SRAM, 1KX4, 200ns, CMOS, PDIP18, DIP-18
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Package Description | DIP, | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 200 ns | |
| Additional Feature | ADDRESS LATCH; LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS | |
| JESD-30 Code | R-PDIP-T18 | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 1024 words | |
| Number of Words Code | 1000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1KX4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |