HM3-6514B-9+
Description: IC,SRAM,1KX4,CMOS,DIP,18PIN,PLASTIC

Overview of HM3-6514B-9+ by Intersil Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 10 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Consumer Electronics Internet of Things (IoT) Smart Cities

Available Datasheets

Part # Manufacturer Description Datasheet
R5F56514BDLJ#20 Renesas Electronics Corporation 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities
R5F56514BDLK#20 Renesas Electronics Corporation 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities
R5F56514BGBP#20 Renesas Electronics Corporation 32-bit Microcontrollers with RXv2 Core, Large-capacity RAM, and Enhanced Security, Connectivity and HMI Capabilities

CAD Models for HM3-6514B-9+ by Intersil Corporation
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Part Data Attributes for HM3-6514B-9+ by Intersil Corporation

HM3-6514B-9+
Intersil Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
INTERSIL CORP
Package Description
DIP, DIP18,.3
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
220 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T18
JESD-609 Code
e0
Memory Density
4096 bit
Memory IC Type
STANDARD SRAM
Memory Width
4
Number of Terminals
18
Number of Words
1024 words
Number of Words Code
1000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
1KX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Standby Current-Max
0.000015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.019 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Want to compare parts?
  1. HM3-6514B-9+
    Intersil Corporation
    IC,SRAM,1KX4,CMOS,DIP,18PIN,PLASTIC
    VS

Alternate Parts for HM3-6514B-9+

This table gives cross-reference parts and alternative options found for HM3-6514B-9+. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM3-6514B-9+, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MAS5114CC SRAM Dynex Semiconductor HM3-6514B-9+ vs MAS5114CC
MAR5114CD SRAM Dynex Semiconductor HM3-6514B-9+ vs MAR5114CD
M38510/28904BVA Standard SRAM, 1KX4, 55ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 QP Semiconductor HM3-6514B-9+ vs M38510/28904BVA
MAR5114CE SRAM Dynex Semiconductor HM3-6514B-9+ vs MAR5114CE
MAL5114CC SRAM Dynex Semiconductor HM3-6514B-9+ vs MAL5114CC
MAR5114CC SRAM Dynex Semiconductor HM3-6514B-9+ vs MAR5114CC
M38510/28902BVX Standard SRAM, 1KX4, 35ns, CMOS, 0.25 X 0.9375 INCH, DIP-18 QP Semiconductor HM3-6514B-9+ vs M38510/28902BVX
5962-8751307VA Standard SRAM, 1KX4, 25ns, CMOS, CDIP18, CERAMIC, DIP-18 QP Semiconductor HM3-6514B-9+ vs 5962-8751307VA
MAR5114CL SRAM Dynex Semiconductor HM3-6514B-9+ vs MAR5114CL
M38510/24502BVX 1KX4 STANDARD SRAM, 120ns, DIP18, 0.250 X 0.9375 INCH, DIP-18 Intersil Corporation HM3-6514B-9+ vs M38510/24502BVX

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