Datasheets
H5TQ2G63BFR-RDJ by: SK Hynix Inc

DDR DRAM, 128MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96

Part Details for H5TQ2G63BFR-RDJ by SK Hynix Inc

Overview of H5TQ2G63BFR-RDJ by SK Hynix Inc

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Applications Consumer Electronics

Part Details for H5TQ2G63BFR-RDJ

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H5TQ2G63BFR-RDJ Part Data Attributes

H5TQ2G63BFR-RDJ SK Hynix Inc
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H5TQ2G63BFR-RDJ SK Hynix Inc DDR DRAM, 128MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description TFBGA, BGA96,9X16,32
Pin Count 96
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.195 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 933 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96
JESD-609 Code e1
Length 13 mm
Memory Density 2147483648 bit
Memory IC Type DDR3 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.012 A
Supply Current-Max 0.24 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 9 mm

Alternate Parts for H5TQ2G63BFR-RDJ

This table gives cross-reference parts and alternative options found for H5TQ2G63BFR-RDJ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5TQ2G63BFR-RDJ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDJ2116DEBG-DJ-F DDR DRAM, 128MX16, 20ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 Elpida Memory Inc H5TQ2G63BFR-RDJ vs EDJ2116DEBG-DJ-F
MT41J128M16HA-187:D DDR DRAM, 128MX16, CMOS, PBGA96, 9 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc H5TQ2G63BFR-RDJ vs MT41J128M16HA-187:D
NT5CB128M16BP-DG DDR DRAM, 128MX16, CMOS, PBGA96, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 Nanya Technology Corporation H5TQ2G63BFR-RDJ vs NT5CB128M16BP-DG
H5TQ2G63BFR-PBJ DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ2G63BFR-RDJ vs H5TQ2G63BFR-PBJ
MT41K128M16HA-15E:D DDR DRAM, 128MX16, CMOS, PBGA96, 9 X 14 MM, LEAD FREE, FBGA-96 Silicon360 H5TQ2G63BFR-RDJ vs MT41K128M16HA-15E:D
H5TQ2G63FFR-PBC DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, FBGA-96 SK Hynix Inc H5TQ2G63BFR-RDJ vs H5TQ2G63FFR-PBC
H5TQ2G63DFR-RDJ DDR DRAM, 128MX16, 0.195ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ2G63BFR-RDJ vs H5TQ2G63DFR-RDJ
H5TQ2G63FFR-PBL DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, FBGA-96 SK Hynix Inc H5TQ2G63BFR-RDJ vs H5TQ2G63FFR-PBL
H5TQ2G63DFR-PBC DDR DRAM, 128MX16, 0.225ns, CMOS, PBGA96, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 SK Hynix Inc H5TQ2G63BFR-RDJ vs H5TQ2G63DFR-PBC
MT41J128M16HA-125AAT:D DDR DRAM, 128MX16, CMOS, PBGA96, 9 X 14 MM, LEAD FREE, FBGA-96 Micron Technology Inc H5TQ2G63BFR-RDJ vs MT41J128M16HA-125AAT:D

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