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Memory / SRAMs / GS8672D36BGE-300
Datasheets
GS8672D36BGE-300 by: GSI Technology

Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8672D36BGE-300 by GSI Technology

Overview of GS8672D36BGE-300 by GSI Technology

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Price & Stock for GS8672D36BGE-300

Part # Distributor Description Stock Price Buy
DISTI # GS8672D36BGE-300
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: GS8672D36BGE-300) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 12 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 464-GS8672D36BGE-300
Mouser Electronics SRAM RoHS: Compliant 0
  • 1 $125.3500
  • 10 $112.8600
  • 30 $110.3700
  • 60 $108.0500
$108.0500 / $125.3500 Order Now

Part Details for GS8672D36BGE-300

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GS8672D36BGE-300 Part Data Attributes:

Parametric Data
GS8672D36BGE-300 GSI Technology
Buy Now Datasheet
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GS8672D36BGE-300 GSI Technology Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINE ARCHITECTURE
Clock Frequency-Max (fCLK) 300 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type STANDARD SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Standby Voltage-Min 1.7 V
Supply Current-Max 1.48 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm

Alternate Parts for GS8672D36BGE-300

This table gives cross-reference parts and alternative options found for GS8672D36BGE-300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8672D36BGE-300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8672D36BE-300 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D36BE-300
CY7C1515KV18-300BZXC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8672D36BGE-300 vs CY7C1515KV18-300BZXC
GS8662D36BGD-300 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8662D36BGD-300
IS61QDB42M36A-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8672D36BGE-300 vs IS61QDB42M36A-300M3L
CY7C1515KV18-300BZCT Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8672D36BGE-300 vs CY7C1515KV18-300BZCT
GS8662D36BD-300 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8662D36BD-300
CY7C1515KV18-300BZC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Infineon Technologies AG GS8672D36BGE-300 vs CY7C1515KV18-300BZC
Part Number Description Manufacturer Compare
GS8672Q37BE-375I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672Q37BE-375I
GS8672D36BE-333I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D36BE-333I
GS8672D37BE-400I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D37BE-400I
GS8672D38BE-550I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D38BE-550I
GS8672Q38BGE-500I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672Q38BGE-500I
GS8672D37BE-300 Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D37BE-300
GS8672Q36BE-200I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672Q36BE-200I
GS8672D36BE-200I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672D36BE-200I
GS8672T36BE-333 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672T36BE-333
GS8672Q38BGE-450I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8672D36BGE-300 vs GS8672Q38BGE-450I

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