Part Details for GM23C4100-20 by Goldstar Electron Co Ltd
Overview of GM23C4100-20 by Goldstar Electron Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for GM23C4100-20
GM23C4100-20 CAD Models
GM23C4100-20 Part Data Attributes
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GM23C4100-20
Goldstar Electron Co Ltd
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Datasheet
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GM23C4100-20
Goldstar Electron Co Ltd
MASK ROM, 512KX8, 200ns, CMOS, PDIP40,
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GOLDSTAR ELECTRON CO LTD | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 895 ns | |
| Alternate Memory Width | 16 | |
| JESD-30 Code | R-PDIP-T40 | |
| Memory Density | 8192 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for GM23C4100-20
This table gives cross-reference parts and alternative options found for GM23C4100-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GM23C4100-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY234100P-200 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASITIC, DIP-40 | SK Hynix Inc | GM23C4100-20 vs HY234100P-200 |
| RP534040E | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, DIP-40 | Ricoh Electronic Devices Co Ltd | GM23C4100-20 vs RP534040E |
| KM23C4200A-20 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Samsung Semiconductor | GM23C4100-20 vs KM23C4200A-20 |
| KM23C4100B-20 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Samsung Semiconductor | GM23C4100-20 vs KM23C4100B-20 |
| MB834100A-20P | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, PLASTIC, DIP-40 | FUJITSU Semiconductor Limited | GM23C4100-20 vs MB834100A-20P |
| UPD23C4000AC | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, PLASTIC, DIP-40 | NEC Electronics America Inc | GM23C4100-20 vs UPD23C4000AC |
| LH534000BD-S | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Sharp Corp | GM23C4100-20 vs LH534000BD-S |
| S634000I-P | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, | Gould Ami | GM23C4100-20 vs S634000I-P |
| KM23C4100A-20 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Samsung Semiconductor | GM23C4100-20 vs KM23C4100A-20 |
| LH534000B-SD-50 | MASK ROM, 512KX8, 200ns, CMOS, PDIP40, 0.600 INCH, PLASTIC, DIP-40 | Sharp Corp | GM23C4100-20 vs LH534000B-SD-50 |