Part Details for FT6163-25CMB by Force Technologies Ltd
Overview of FT6163-25CMB by Force Technologies Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Energy and Power Systems
Renewable Energy
Part Details for FT6163-25CMB
FT6163-25CMB CAD Models
FT6163-25CMB Part Data Attributes:
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FT6163-25CMB
Force Technologies Ltd
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Datasheet
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FT6163-25CMB
Force Technologies Ltd
Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, SIDE BRAZED, DIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FORCE TECHNOLOGIES LTD | |
| Package Description | DIP, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| Additional Feature | LG_MAX | |
| JESD-30 Code | R-CDIP-T28 | |
| Length | 37.719 mm | |
| Memory Density | 73728 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX9 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.715 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for FT6163-25CMB
This table gives cross-reference parts and alternative options found for FT6163-25CMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FT6163-25CMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| FT616325CM | Standard SRAM | Force Technologies Ltd | FT6163-25CMB vs FT616325CM |
| P4C163-25DMB | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, CERDIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25DMB |
| P4C163-25DM | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, HERMETIC SEALED, CERDIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25DM |
| P4C163-25CMLF | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25CMLF |
| P4C163-25CM | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25CM |
| P4C163-25CMB | Standard SRAM, 8KX9, 25ns, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25CMB |
| FT6163-25PC | Standard SRAM, 8KX9, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Force Technologies Ltd | FT6163-25CMB vs FT6163-25PC |
| P4C163-25PCLF | Standard SRAM, 8KX9, 25ns, CMOS, PDIP28, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25PCLF |
| P4C163-25PC | Standard SRAM, 8KX9, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Pyramid Semiconductor Corporation | FT6163-25CMB vs P4C163-25PC |
| FT616325CMLF | Standard SRAM | Force Technologies Ltd | FT6163-25CMB vs FT616325CMLF |