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Programmable Logic Programmable Logic Devices EPF10K30EFC256-2

Programmable Logic
EPF10K30EFC256-2
Description: Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256

Overview of EPF10K30EFC256-2 by Altera Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Computing and Data Storage Telecommunications

Price & Stock for EPF10K30EFC256-2 by Altera Corporation

Part # Manufacturer Description Stock Price Buy
DISTI # 2156-EPF10K30EFC256-2-ND
DigiKey IC FPGA 176 I/O 256FBGA Min Qty: 4 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 577
In Stock
  • 4 $81.7200
$81.7200 Buy Now
Bristol Electronics   44
RFQ
Rochester Electronics FLEX 10K Embedded Programmable Logic Device RoHS: Not Compliant Status: Obsolete Min Qty: 1 577
  • 1 $82.5100
  • 25 $80.8600
  • 100 $77.5600
  • 500 $74.2600
  • 1,000 $70.1300
$70.1300 / $82.5100 Buy Now

CAD Models for EPF10K30EFC256-2 by Altera Corporation
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Part Data Attributes for EPF10K30EFC256-2 by Altera Corporation
Parametric Data

EPF10K30EFC256-2
Altera Corporation
Buy Now
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
ALTERA CORP
Part Package Code
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pin Count
256
Reach Compliance Code
not_compliant
HTS Code
8542.39.00.01
Samacsys Manufacturer
Intel
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Moisture Sensitivity Level
3
Number of I/O Lines
176
Number of Inputs
176
Number of Logic Cells
1728
Number of Outputs
176
Number of Terminals
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
176 I/O
Output Function
MIXED
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
220
Programmable Logic Type
LOADABLE PLD
Propagation Delay
0.4 ns
Qualification Status
Not Qualified
Seated Height-Max
2.1 mm
Supply Voltage-Max
2.625 V
Supply Voltage-Min
2.375 V
Supply Voltage-Nom
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
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  1. EPF10K30EFC256-2
    Altera Corporation
    Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
    VS

Alternate Parts for EPF10K30EFC256-2

This table gives cross-reference parts and alternative options found for EPF10K30EFC256-2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPF10K30EFC256-2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
EPF10K30EFC256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2N
EPF10K30EFI256-2 Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFI256-2
EPF10K30EFC256-2X Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2X
EPF10K30EFC256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2N
EPF10K30EFC256-2X Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2X
EPF10K30EFI256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFI256-2N
Part Number Description Manufacturer Compare
EPF10K30EFC256-1N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-1N
EPF10K30EFC256-1X Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-1X
EPF10K30EFC256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2N
EPF10K30EFC256-3N Loadable PLD, 0.6ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-3N
EPF10K30EFC256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2N
EPF10K30EFI256-3 Loadable PLD, 12.5ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFI256-3
EPF10K30EFI256-2N Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFI256-2N
EPF10K30EFC256-1 Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-1
EPF10K30EFC256-2X Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Intel Corporation EPF10K30EFC256-2 vs EPF10K30EFC256-2X
EPF10K30EFI256-2 Loadable PLD, 0.4ns, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 Altera Corporation EPF10K30EFC256-2 vs EPF10K30EFI256-2

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