EPF10K30EFC256-2 vs EPF10K30EFC256-2N feature comparison

EPF10K30EFC256-2 Altera Corporation

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EPF10K30EFC256-2N Altera Corporation

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ALTERA CORP ALTERA CORP
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256 17 X 17 MM, 1 MM PITCH, FINE LINE, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 176 176
Number of Inputs 176 176
Number of Logic Cells 1728 1728
Number of Outputs 176 176
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 176 I/O 176 I/O
Output Function MIXED MIXED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type LOADABLE PLD LOADABLE PLD
Propagation Delay 0.4 ns 0.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.1 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm 17 mm
Base Number Matches 4 1

Compare EPF10K30EFC256-2 with alternatives

Compare EPF10K30EFC256-2N with alternatives