Datasheets
EDI8L32128C12AC by:

SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68

Part Details for EDI8L32128C12AC by Microsemi Corporation

Overview of EDI8L32128C12AC by Microsemi Corporation

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Part Details for EDI8L32128C12AC

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EDI8L32128C12AC Part Data Attributes

EDI8L32128C12AC Microsemi Corporation
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EDI8L32128C12AC Microsemi Corporation SRAM Module, 128KX32, 12ns, CMOS, PQCC68, PLASTIC, MO-47AE, LCC-68
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code LCC
Package Description PLASTIC, MO-47AE, LCC-68
Pin Count 68
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 12 ns
Additional Feature ALSO CONFIGURABLE AS 512K X 8; LG-MAX; WD-MAX
Alternate Memory Width 16
JESD-30 Code S-PQCC-J68
Length 24.2824 mm
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX32
Package Body Material PLASTIC/EPOXY
Package Code QCCJ
Package Shape SQUARE
Package Style CHIP CARRIER
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form J BEND
Terminal Pitch 1.27 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 24.2824 mm

Alternate Parts for EDI8L32128C12AC

This table gives cross-reference parts and alternative options found for EDI8L32128C12AC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8L32128C12AC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDI8L32128C12AC SRAM Module, 512KX8, 12ns, CMOS, PQCC68, PLASTIC, LCC-68 Electronic Designs Inc EDI8L32128C12AC vs EDI8L32128C12AC
Part Number Description Manufacturer Compare
5962-9559509HNX SRAM Module, 128KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68 Microsemi Corporation EDI8L32128C12AC vs 5962-9559509HNX
WS128K32-25G4TMA SRAM Module, 128KX32, 25ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 Microsemi Corporation EDI8L32128C12AC vs WS128K32-25G4TMA
5962-9559510HMX SRAM Module, 128KX32, 17ns, CMOS, CQFP68, QFP-68 Microsemi Corporation EDI8L32128C12AC vs 5962-9559510HMX
ACT-S128K32VN-045F2Q SRAM Module, 128KX32, 45ns, CMOS, CQFP68, 0.880 X 0.880 INCH, 0.200 INCH HEIGHT, DUAL CAVITY, CERAMIC, QFP-68 Cobham Power Products EDI8L32128C12AC vs ACT-S128K32VN-045F2Q
5962F0323602QXA Standard SRAM, 128KX32, 15ns, CMOS, CQFP68, CERAMIC, QFP-68 Cobham Semiconductor Solutions EDI8L32128C12AC vs 5962F0323602QXA
PUMA67S4000LI-10 SRAM Module, 512KX8, 100ns, CMOS, CQCC68 Mosaic Semiconductor Inc EDI8L32128C12AC vs PUMA67S4000LI-10
5962-9559505HXA SRAM Module, 512KX8, 55ns, CMOS, CQFP68, 40 X 40 MM, HERMETIC SEALED, CERAMIC, QFP-68 Microsemi Corporation EDI8L32128C12AC vs 5962-9559505HXA
UT8CR512K32-17VCC SRAM Module, 512KX8, 17ns, CMOS, CQFP68, CERAMIC, QFP-68 Cobham Semiconductor Solutions EDI8L32128C12AC vs UT8CR512K32-17VCC
5962-9559501H9X SRAM Module, 128KX32, 120ns, CMOS, CQMA68, CERAMIC, LQFP-68 Microsemi Corporation EDI8L32128C12AC vs 5962-9559501H9X
5962-9559507HNC SRAM Module, 128KX32, 35ns, CMOS, CQFP68, CERAMIC, QFP-68 Microsemi Corporation EDI8L32128C12AC vs 5962-9559507HNC

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