Datasheets
EDI88512C100CM by:

Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

Part Details for EDI88512C100CM by Mercury Systems Inc

Overview of EDI88512C100CM by Mercury Systems Inc

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Part Details for EDI88512C100CM

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EDI88512C100CM Part Data Attributes

EDI88512C100CM Mercury Systems Inc
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EDI88512C100CM Mercury Systems Inc Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer MERCURY SYSTEMS INC
Package Description 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T32
Length 40.64 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 3.937 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for EDI88512C100CM

This table gives cross-reference parts and alternative options found for EDI88512C100CM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88512C100CM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDI88512LP100CC Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, Electronic Designs Inc EDI88512C100CM vs EDI88512LP100CC
EDI88512LP100CB Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88512C100CM vs EDI88512LP100CB
AS5C4009CW-100/H Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components EDI88512C100CM vs AS5C4009CW-100/H
EDI88512LP100CI Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88512C100CM vs EDI88512LP100CI
P4C1048L-100CWM Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Pyramid Semiconductor Corporation EDI88512C100CM vs P4C1048L-100CWM
AS5C4009CW-100/IT Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components EDI88512C100CM vs AS5C4009CW-100/IT
CYM1465LPD-100C SRAM Module, 512KX8, 100ns, CMOS Cypress Semiconductor EDI88512C100CM vs CYM1465LPD-100C
5962-9561302HYC Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, CERAMIC, DIP-32 White Microelectronics EDI88512C100CM vs 5962-9561302HYC
EDI88512C100CC Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, Electronic Designs Inc EDI88512C100CM vs EDI88512C100CC
5962-9561302HYA Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, CERAMIC, DIP-32 Micross Components EDI88512C100CM vs 5962-9561302HYA
Part Number Description Manufacturer Compare
EDI88512LP100NC Standard SRAM, 512KX8, 100ns, CMOS, CDSO32, CERAMIC, SOJ-32 Mercury Systems Inc EDI88512C100CM vs EDI88512LP100NC
5962-9561302HYX Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88512C100CM vs 5962-9561302HYX
P4C1048L-100CWI Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Pyramid Semiconductor Corporation EDI88512C100CM vs P4C1048L-100CWI
EDI88512LP100NI Standard SRAM, 512KX8, 100ns, CMOS, CDSO32, Electronic Designs Inc EDI88512C100CM vs EDI88512LP100NI
EDI88512LP100NC Standard SRAM, 512KX8, 100ns, CMOS, CDSO32, Electronic Designs Inc EDI88512C100CM vs EDI88512LP100NC
EDI88512C100NB Standard SRAM, 512KX8, 100ns, CMOS, CDSO32, CERAMIC, SOJ-32 Mercury Systems Inc EDI88512C100CM vs EDI88512C100NB
EDI88512LP100CB Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88512C100CM vs EDI88512LP100CB
CYM1466HD-100MB SRAM Module, 512KX8, 100ns, CMOS Cypress Semiconductor EDI88512C100CM vs CYM1466HD-100MB
AS5C4009CW-100/IT Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components EDI88512C100CM vs AS5C4009CW-100/IT
5962-9561302HYC Standard SRAM, 512KX8, 100ns, CMOS, CDIP32, CERAMIC, DIP-32 Mercury Systems Inc EDI88512C100CM vs 5962-9561302HYC

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