Part Details for EDI8833LP55FB by Electronic Designs Inc
Overview of EDI8833LP55FB by Electronic Designs Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for EDI8833LP55FB
EDI8833LP55FB CAD Models
EDI8833LP55FB Part Data Attributes
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EDI8833LP55FB
Electronic Designs Inc
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Datasheet
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EDI8833LP55FB
Electronic Designs Inc
Standard SRAM, 32KX8, 55ns, CMOS, CDFP28,
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ELECTRONIC DESIGNS INC | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDFP-F28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DFP | |
| Package Equivalence Code | FL28,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | 38535Q/M;38534H;883B | |
| Standby Current-Max | 0.00035 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.125 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL |
Alternate Parts for EDI8833LP55FB
This table gives cross-reference parts and alternative options found for EDI8833LP55FB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8833LP55FB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8866203TX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28 | LOGIC Devices Inc | EDI8833LP55FB vs 5962-8866203TX |
| 5962-8866203TX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, | Teledyne e2v | EDI8833LP55FB vs 5962-8866203TX |
| 5962-8866203TX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, | Electronic Designs Inc | EDI8833LP55FB vs 5962-8866203TX |
| 5962-8866203TX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, DFP-28 | Micross Components | EDI8833LP55FB vs 5962-8866203TX |
| 5962-8855208NX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERAMIC, FP-28 | Teledyne e2v | EDI8833LP55FB vs 5962-8855208NX |
| IDT71256S55XEB | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, CERPACK-28 | Integrated Device Technology Inc | EDI8833LP55FB vs IDT71256S55XEB |
| 5962-8855203NX | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28, | Teledyne e2v | EDI8833LP55FB vs 5962-8855203NX |
| 5962-8866203MC | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28 | LOGIC Devices Inc | EDI8833LP55FB vs 5962-8866203MC |
| MSM832GM-55 | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28 | Mosaic Semiconductor Inc | EDI8833LP55FB vs MSM832GM-55 |
| MSM832GPM-55 | Standard SRAM, 32KX8, 55ns, CMOS, CDFP28 | Mosaic Semiconductor Inc | EDI8833LP55FB vs MSM832GPM-55 |