Datasheets
EDI88257LPA20CI by:

Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32

Part Details for EDI88257LPA20CI by Microsemi Corporation

Overview of EDI88257LPA20CI by Microsemi Corporation

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Applications Industrial Automation

Part Details for EDI88257LPA20CI

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EDI88257LPA20CI Part Data Attributes

EDI88257LPA20CI Microsemi Corporation
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EDI88257LPA20CI Microsemi Corporation Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code DIP
Package Description 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 20 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T32
Length 40.64 mm
Memory Density 2097152 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 3.937 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for EDI88257LPA20CI

This table gives cross-reference parts and alternative options found for EDI88257LPA20CI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88257LPA20CI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EDI88257CA20CM Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA20CM
EDI88257LPA20CM Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257LPA20CM
EDI88257CA20CB Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA20CI vs EDI88257CA20CB
EDI88257LPA20CI Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA20CI vs EDI88257LPA20CI
EDI88257CA20CC Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA20CI vs EDI88257CA20CC
EDI88257CA20CI Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 White Microelectronics EDI88257LPA20CI vs EDI88257CA20CI
EDI88257CA20CB Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA20CB
EDI88257LPA20CC Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc EDI88257LPA20CI vs EDI88257LPA20CC
EDI88257CA20CI Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA20CI
EDI88257LPA20CB Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257LPA20CB
Part Number Description Manufacturer Compare
MS8256FKP-10 SRAM Module, 256KX8, 100ns, CMOS Mosaic Semiconductor Inc EDI88257LPA20CI vs MS8256FKP-10
EDI88257CA20CI Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA20CI
5962-9315703HYX SRAM Module, 256KX8, 85ns, CMOS, DIP-32 Microsemi Corporation EDI88257LPA20CI vs 5962-9315703HYX
EDI88257CA20CC Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA20CC
EDI88257CA35CC Standard SRAM, 256KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257CA35CC
DS1249Y-70IND Non-Volatile SRAM Module, 256KX8, 70ns, CMOS, 0.740 INCH, DIP-32 Maxim Integrated Products EDI88257LPA20CI vs DS1249Y-70IND
EDI88257LPA45CI Standard SRAM, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257LPA45CI
5962-9315706HXX SRAM Module, 256KX8, 45ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs 5962-9315706HXX
MS8256FKL-12 SRAM Module, 256KX8, 120ns, CMOS Mosaic Semiconductor Inc EDI88257LPA20CI vs MS8256FKL-12
EDI88257LPA20CC Standard SRAM, 256KX8, 20ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation EDI88257LPA20CI vs EDI88257LPA20CC

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