Part Details for 5962-9315703HYX by Microsemi Corporation
Overview of 5962-9315703HYX by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Renewable Energy
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9315703HYX
5962-9315703HYX CAD Models
5962-9315703HYX Part Data Attributes
|
|
5962-9315703HYX
Microsemi Corporation
Buy Now
|
Compare Parts:
5962-9315703HYX
Microsemi Corporation
SRAM Module, 256KX8, 85ns, CMOS, DIP-32
|
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 85 ns | |
| JESD-30 Code | R-XDIP-T32 | |
| Length | 41.525 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 256KX8 | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.13 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-9315703HYX
This table gives cross-reference parts and alternative options found for 5962-9315703HYX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9315703HYX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS256S8P-85I | SRAM Module, 256KX8, 85ns, CMOS, CDMA32, CERDIP-32 | B&B Electronics Manufacturing Company | 5962-9315703HYX vs DPS256S8P-85I |
| 5962-9315703HXC | Multi-Port SRAM Module, 256KX8, 85ns, CMOS, CDIP32, | Microsemi Corporation | 5962-9315703HYX vs 5962-9315703HXC |
| DPS256S8PLL-85I | SRAM Module, 256KX8, 85ns, CMOS, CDMA32, CERDIP-32 | B&B Electronics Manufacturing Company | 5962-9315703HYX vs DPS256S8PLL-85I |
| 5962-9315703HYA | SRAM Module, 256KX8, 85ns, CMOS, DIP-32 | Microsemi Corporation | 5962-9315703HYX vs 5962-9315703HYA |
| DPS256S8PLL-85C | SRAM Module, 256KX8, 85ns, CMOS, CDMA32, CERDIP-32 | B&B Electronics Manufacturing Company | 5962-9315703HYX vs DPS256S8PLL-85C |
| 5962-9315703HXX | SRAM Module, 256KX8, 85ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9315703HYX vs 5962-9315703HXX |