Part Details for EDI88257CA25CI by Microsemi Corporation
Overview of EDI88257CA25CI by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for EDI88257CA25CI
EDI88257CA25CI CAD Models
EDI88257CA25CI Part Data Attributes:
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EDI88257CA25CI
Microsemi Corporation
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EDI88257CA25CI
Microsemi Corporation
Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-CDIP-T32 | |
Length | 40.64 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.937 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for EDI88257CA25CI
This table gives cross-reference parts and alternative options found for EDI88257CA25CI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88257CA25CI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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EDI88257LPA25CM | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257LPA25CM |
EDI88257LPA25CC | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | EDI88257CA25CI vs EDI88257LPA25CC |
EDI88257LPA25CI | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257LPA25CI |
EDI88257LPA25CB | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | EDI88257CA25CI vs EDI88257LPA25CB |
EDI88257LPA25CB | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257LPA25CB |
EDI88257CA25CM | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257CA25CM |
EDI88257CA25CI | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257CA25CI |
EDI88257LPA25CC | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | EDI88257CA25CI vs EDI88257LPA25CC |
EDI88257CA25CC | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | EDI88257CA25CI vs EDI88257CA25CC |
EDI88257CA25CB | Standard SRAM, 256KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88257CA25CI vs EDI88257CA25CB |