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Memory / Flash Memories / DPZ128X32VSP-25C
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DPZ128X32VSP-25C by:

Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66

Part Details for DPZ128X32VSP-25C by B&B Electronics Manufacturing Company

Overview of DPZ128X32VSP-25C by B&B Electronics Manufacturing Company

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for DPZ128X32VSP-25C

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DPZ128X32VSP-25C Part Data Attributes

Parametric Data
DPZ128X32VSP-25C B&B Electronics Manufacturing Company
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DPZ128X32VSP-25C B&B Electronics Manufacturing Company Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Part Package Code PGA
Package Description PGA, PGA66,11X11
Pin Count 66
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 250 ns
Additional Feature USER CONFIGURABLE AS 128K X 32
Alternate Memory Width 16
Data Polling NO
JESD-30 Code S-CPGA-P66
JESD-609 Code e0
Memory Density 4194304 bit
Memory IC Type FLASH MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 66
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 8.382 mm
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Toggle Bit NO
Type NOR TYPE

Alternate Parts for DPZ128X32VSP-25C

This table gives cross-reference parts and alternative options found for DPZ128X32VSP-25C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPZ128X32VSP-25C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DPZ128X32VSP-25I Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPZ128X32VSP-25I
DPZ128X32VA-25B Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc DPZ128X32VSP-25C vs DPZ128X32VA-25B
DPZ128X32VA-25M Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc DPZ128X32VSP-25C vs DPZ128X32VA-25M
DPZ128X32VTP-25C Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPZ128X32VTP-25C
DPZ128X32VSP-25I Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc DPZ128X32VSP-25C vs DPZ128X32VSP-25I
DPZ128X32VS-25C Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc DPZ128X32VSP-25C vs DPZ128X32VS-25C
DPZ128X32VS-25B Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPZ128X32VS-25B
DPZ128X32VA-25I Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPZ128X32VA-25I
DPZ128X32VS-25M Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc DPZ128X32VSP-25C vs DPZ128X32VS-25M
DPZ128X32VS-25I Flash Module, 512KX8, 250ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPZ128X32VS-25I
Part Number Description Manufacturer Compare
WF128K32-150HC5 Flash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WF128K32-150HC5
WF128K32-90HSI5 Flash Module, 512KX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WF128K32-90HSI5
WF128K32-120H1I5A Flash Module, 128KX32, 120ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WF128K32-120H1I5A
WE128K32N200H1IA 128KX32 EEPROM 5V MODULE, 200ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WE128K32N200H1IA
WF128K32-90HSC5 Flash Module, 512KX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WF128K32-90HSC5
5962-9458502HTA EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CHIP66, Microsemi Corporation DPZ128X32VSP-25C vs 5962-9458502HTA
5962-9458503HTC EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CHIP66, Microsemi Corporation DPZ128X32VSP-25C vs 5962-9458503HTC
DPE128X32V-15M EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CPGA66, PGA-66 B&B Electronics Manufacturing Company DPZ128X32VSP-25C vs DPE128X32V-15M
WE128K32N-200H1M EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WE128K32N-200H1M
WF128K32-90HI5 Flash Module, 512KX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32VSP-25C vs WF128K32-90HI5

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