DPZ128X32VSP-25C vs WE128K32N-200H1M feature comparison

DPZ128X32VSP-25C B&B Electronics Manufacturing Company

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WE128K32N-200H1M Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP MICROSEMI CORP
Part Package Code PGA
Package Description PGA, PGA66,11X11 PGA,
Pin Count 66
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 250 ns 200 ns
Additional Feature USER CONFIGURABLE AS 128K X 32 ALSO CONFIGURABLE AS 512K X 8
Alternate Memory Width 16 16
Data Polling NO
JESD-30 Code S-CPGA-P66 S-CPGA-P66
JESD-609 Code e0
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH MODULE EEPROM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 128KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 8.382 mm 4.6 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Toggle Bit NO
Type NOR TYPE
Base Number Matches 1 4
Pbfree Code No
Length 27.3 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 27.3 mm
Write Cycle Time-Max (tWC) 10 ms

Compare DPZ128X32VSP-25C with alternatives

Compare WE128K32N-200H1M with alternatives