Datasheets
DPS512S8AP-55I by:

SRAM Module, 512KX8, 55ns, CMOS, CDMA32, CERDIP-32

Part Details for DPS512S8AP-55I by Twilight Technology Inc

Overview of DPS512S8AP-55I by Twilight Technology Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for DPS512S8AP-55I

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DPS512S8AP-55I Part Data Attributes

DPS512S8AP-55I Twilight Technology Inc
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DPS512S8AP-55I Twilight Technology Inc SRAM Module, 512KX8, 55ns, CMOS, CDMA32, CERDIP-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TWILIGHT TECHNOLOGY INC
Part Package Code MODULE
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 55 ns
I/O Type COMMON
JESD-30 Code R-CDMA-T32
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V
Supply Current-Max 0.245 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for DPS512S8AP-55I

This table gives cross-reference parts and alternative options found for DPS512S8AP-55I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512S8AP-55I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS512K8-55CCE SRAM Module, 512KX8, 55ns, CMOS, CDMA32, Microsemi Corporation DPS512S8AP-55I vs WS512K8-55CCE
WS512K8-55CM SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs WS512K8-55CM
WMS512K8-55CC Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs WMS512K8-55CC
DPS512S8BN-55M SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 Twilight Technology Inc DPS512S8AP-55I vs DPS512S8BN-55M
5962-9561305HYC Cache SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 Micross Components DPS512S8AP-55I vs 5962-9561305HYC
WMS512K8-55CMA Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs WMS512K8-55CMA
5962-9207805HXX SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 White Electronic Designs Corp DPS512S8AP-55I vs 5962-9207805HXX
5962-9561305HYA Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 White Microelectronics DPS512S8AP-55I vs 5962-9561305HYA
5962-9207805HTX SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs 5962-9207805HTX
5962-9561305HYX Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 Cobham Power Products DPS512S8AP-55I vs 5962-9561305HYX
Part Number Description Manufacturer Compare
WS512K8-55CCE SRAM Module, 512KX8, 55ns, CMOS, CDMA32, Microsemi Corporation DPS512S8AP-55I vs WS512K8-55CCE
SYS8512FKX-55 SRAM Module, 512KX8, 55ns, CMOS, PDIP32, PLASTIC, DIP-32 Mosaic Semiconductor Inc DPS512S8AP-55I vs SYS8512FKX-55
EDI8M8512LP55C6B SRAM Module, 512KX8, 55ns, CMOS, Electronic Designs Inc DPS512S8AP-55I vs EDI8M8512LP55C6B
MS8512SCMB-55 SRAM Module, 512KX8, 55ns, CMOS Mosaic Semiconductor Inc DPS512S8AP-55I vs MS8512SCMB-55
5962-9207805HTX SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs 5962-9207805HTX
5962-9207805HTA SRAM Module, 512KX8, 55ns, CMOS, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs 5962-9207805HTA
WMS512K8-55CQ Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-55I vs WMS512K8-55CQ
EDI88512LP55CB Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, Electronic Designs Inc DPS512S8AP-55I vs EDI88512LP55CB
DPS512S8BN-55C SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 Twilight Technology Inc DPS512S8AP-55I vs DPS512S8BN-55C
MS8512FK-55 SRAM Module, 512KX8, 55ns, CMOS Mosaic Semiconductor Inc DPS512S8AP-55I vs MS8512FK-55

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