Part Details for DPS512S8AP-55I by Twilight Technology Inc
Overview of DPS512S8AP-55I by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for DPS512S8AP-55I
DPS512S8AP-55I CAD Models
DPS512S8AP-55I Part Data Attributes
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DPS512S8AP-55I
Twilight Technology Inc
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Datasheet
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DPS512S8AP-55I
Twilight Technology Inc
SRAM Module, 512KX8, 55ns, CMOS, CDMA32, CERDIP-32
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
Part Package Code | MODULE | |
Package Description | DIP, DIP32,.6 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-CDMA-T32 | |
Memory Density | 4194304 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DIP | |
Package Equivalence Code | DIP32,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.0016 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.245 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for DPS512S8AP-55I
This table gives cross-reference parts and alternative options found for DPS512S8AP-55I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512S8AP-55I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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WS512K8-55CCE | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, | Microsemi Corporation | DPS512S8AP-55I vs WS512K8-55CCE |
WS512K8-55CM | SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | DPS512S8AP-55I vs WS512K8-55CM |
WMS512K8-55CC | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | DPS512S8AP-55I vs WMS512K8-55CC |
DPS512S8BN-55M | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | Twilight Technology Inc | DPS512S8AP-55I vs DPS512S8BN-55M |
5962-9561305HYC | Cache SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Micross Components | DPS512S8AP-55I vs 5962-9561305HYC |
WMS512K8-55CMA | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | DPS512S8AP-55I vs WMS512K8-55CMA |
5962-9207805HXX | SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | DPS512S8AP-55I vs 5962-9207805HXX |
5962-9561305HYA | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | White Microelectronics | DPS512S8AP-55I vs 5962-9561305HYA |
5962-9207805HTX | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | DPS512S8AP-55I vs 5962-9207805HTX |
5962-9561305HYX | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Cobham Power Products | DPS512S8AP-55I vs 5962-9561305HYX |