Part Details for 5962-9207805HXX by White Electronic Designs Corp
Overview of 5962-9207805HXX by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 5962-8672601EA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.875 INCH, DIP-16 | |
| 5962-8672601FA | Rochester Electronics LLC | Parity Generator/Checker, S Series, 12-Bit, Inverted Output, TTL, 0.250 X 0.375 INCH, FP-16 | |
| 5962-87518013A | Rochester Electronics LLC | Interrupt Controller, NMOS, CQCC28, CERAMIC, LCC-28 |
Part Details for 5962-9207805HXX
5962-9207805HXX CAD Models
5962-9207805HXX Part Data Attributes
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5962-9207805HXX
White Electronic Designs Corp
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Datasheet
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5962-9207805HXX
White Electronic Designs Corp
SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| Additional Feature | BATTERY BACK-UP OPERATION | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 42.4 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-9207805HXX
This table gives cross-reference parts and alternative options found for 5962-9207805HXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9207805HXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS512K8-55CCE | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, | Microsemi Corporation | 5962-9207805HXX vs WS512K8-55CCE |
| WS512K8-55CM | SRAM Module, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9207805HXX vs WS512K8-55CM |
| WMS512K8-55CC | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9207805HXX vs WMS512K8-55CC |
| DPS512S8BN-55M | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | Twilight Technology Inc | 5962-9207805HXX vs DPS512S8BN-55M |
| 5962-9561305HYC | Cache SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Micross Components | 5962-9207805HXX vs 5962-9561305HYC |
| WMS512K8-55CMA | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9207805HXX vs WMS512K8-55CMA |
| 5962-9561305HYA | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | White Microelectronics | 5962-9207805HXX vs 5962-9561305HYA |
| 5962-9207805HTX | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9207805HXX vs 5962-9207805HTX |
| 5962-9561305HYX | Standard SRAM, 512KX8, 55ns, CMOS, CDIP32, DIP, CERAMIC-32 | Cobham Power Products | 5962-9207805HXX vs 5962-9561305HYX |
| DPS512S8AP-55C | SRAM Module, 512KX8, 55ns, CMOS, CDMA32, CERDIP-32 | Twilight Technology Inc | 5962-9207805HXX vs DPS512S8AP-55C |