Part Details for DPS256X32V3-10I by Twilight Technology Inc
Overview of DPS256X32V3-10I by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS256X32V3-10I
DPS256X32V3-10I CAD Models
DPS256X32V3-10I Part Data Attributes
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DPS256X32V3-10I
Twilight Technology Inc
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Datasheet
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DPS256X32V3-10I
Twilight Technology Inc
SRAM Module, 256KX32, 100ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
| Part Package Code | PGA | |
| Package Description | PGA, PGA66,11X11 | |
| Pin Count | 66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 100 ns | |
| Additional Feature | USER CONFIGURABLE AS 1M X 8 | |
| Alternate Memory Width | 16 | |
| I/O Type | COMMON | |
| JESD-30 Code | S-CPGA-P66 | |
| Memory Density | 8388608 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Equivalence Code | PGA66,11X11 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 10.16 mm | |
| Standby Current-Max | 0.00068 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.305 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for DPS256X32V3-10I
This table gives cross-reference parts and alternative options found for DPS256X32V3-10I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS256X32V3-10I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| DPS256X32V3-10M | SRAM Module, 256KX32, 100ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS256X32V3-10I vs DPS256X32V3-10M |
| DPS256X32V3-10C | SRAM Module, 256KX32, 100ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32V3-10I vs DPS256X32V3-10C |
| DPS256X32V3-10M | SRAM Module, 256KX32, 100ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS256X32V3-10I vs DPS256X32V3-10M |