Datasheets
DM74S474J by:

IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM

Part Details for DM74S474J by National Semiconductor Corporation

Overview of DM74S474J by National Semiconductor Corporation

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Part Details for DM74S474J

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DM74S474J Part Data Attributes:

DM74S474J National Semiconductor Corporation
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DM74S474J National Semiconductor Corporation IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP24,.6
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 65 ns
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Memory Density 4096 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.572 mm
Supply Current-Max 0.17 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for DM74S474J

This table gives cross-reference parts and alternative options found for DM74S474J. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DM74S474J, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DM74S474N IC 512 X 8 OTPROM, 65 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM National Semiconductor Corporation DM74S474J vs DM74S474N
TBP28SA46NW 512X8 OTPROM, 65ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 Texas Instruments DM74S474J vs TBP28SA46NW
DM74S474J IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM Texas Instruments DM74S474J vs DM74S474J
DM74S474N 512X8 OTPROM, 65ns, PDIP24, PLASTIC, DIP-24 Texas Instruments DM74S474J vs DM74S474N
DM74S475J IC 512 X 8 OTPROM, 65 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation DM74S474J vs DM74S475J
Part Number Description Manufacturer Compare
DM87SR476BN IC 512 X 8 OTPROM, PDIP24, PLASTIC, DIP-24, Programmable ROM National Semiconductor Corporation DM74S474J vs DM87SR476BN
CY7C225A-25DC OTP ROM, 512X8, 12ns, CMOS, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor DM74S474J vs CY7C225A-25DC
63RA481JSXXXX OTP ROM, 512X8, 30ns, CMOS, CDIP24, Monolithic Memories (RETIRED) DM74S474J vs 63RA481JSXXXX
AM27S25SADCB OTP ROM, 512X8, 12ns, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 AMD DM74S474J vs AM27S25SADCB
AM27S25/B3C OTP ROM, 512X8, 30ns, Bipolar, CQCC28, CERAMIC, LCC-28 AMD DM74S474J vs AM27S25/B3C
DM74S474BN IC 512 X 8 OTPROM, 35 ns, PDIP24, PLASTIC, DIP-24, Programmable ROM National Semiconductor Corporation DM74S474J vs DM74S474BN
6341-1LXXXX OTP ROM, 512X8, 70ns, CMOS, MQCC28, Monolithic Memories (RETIRED) DM74S474J vs 6341-1LXXXX
CY7C225A-30PI OTP ROM, 512X8, 15ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor DM74S474J vs CY7C225A-30PI
AM27S31DC OTP ROM, 512X8, 55ns, Bipolar, CDIP24, CERAMIC, DIP-24 AMD DM74S474J vs AM27S31DC
DM87SR474BJ IC 512 X 8 OTPROM, CDIP24, CERAMIC, DIP-24, Programmable ROM Texas Instruments DM74S474J vs DM87SR474BJ

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